We studied a technique for fabricating metallic nanostamps with void-free, high-aspect-ratio nanostructures, using a pulse reverse current (PRC) electroforming process. During conventional electroforming of high-aspect-ratio nanostructures, a high current distribution is concentrated at the top and bottom corners, resulting in relatively fast growth of the nickel electroformed layer. This phenomenon leads to the formation of nanovoids in a metallic nanostamp, causing degradation of the stamp performance. To prevent the formation of nanovoids, we controlled the current waveform during the electroforming process. In this way, the process suppressed the formation of nanovoids, while effectively achieving a uniform current distribution. As practical examples, two types of metallic nanostamps were fabricated via direct current and PRC electroforming processes, one with a pitch of 0.8 m and a height of 1.8 m, and another with a pitch of 350 nm and a height of 525 nm. The internal nanovoids developed during the electroforming process were measured and analyzed.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering