Encapsulation of the micromachined air-suspended inductors

Yun Seok Choi; Euisik Yoon; Jun Bo Yoon

Encapsulation of the micromachined air-suspended inductors

Yun Seok Choi, Euisik Yoon, Jun Bo Yoon

Yonsei-IBS Institute

Research output: Contribution to journal › Conference article

6 Citations (Scopus)

Abstract

We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20% degradation of integrated inductor Q-factor has been observed.

Original language	English
Pages (from-to)	1637-1640
Number of pages	4
Journal	IEEE MTT-S International Microwave Symposium Digest
Volume	3
Publication status	Published - 2003 Aug 18
Event	2003 IEEE MTT-S International Microwave Symposium Digest - Philadelphia, PA, United States Duration: 2003 Jun 8 → 2003 Jun 13

All Science Journal Classification (ASJC) codes

Radiation
Condensed Matter Physics
Electrical and Electronic Engineering

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Choi, Y. S., Yoon, E., & Yoon, J. B. (2003). Encapsulation of the micromachined air-suspended inductors. IEEE MTT-S International Microwave Symposium Digest, 3, 1637-1640.

@article{14e2169e29194159bf8f44f72ed59424,

title = "Encapsulation of the micromachined air-suspended inductors",

abstract = "We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20% degradation of integrated inductor Q-factor has been observed.",

author = "Choi, {Yun Seok} and Euisik Yoon and Yoon, {Jun Bo}",

year = "2003",

month = aug,

day = "18",

language = "English",

volume = "3",

pages = "1637--1640",

journal = "IEEE MTT-S International Microwave Symposium Digest",

issn = "0149-645X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2003 IEEE MTT-S International Microwave Symposium Digest ; Conference date: 08-06-2003 Through 13-06-2003",

}

TY - JOUR

T1 - Encapsulation of the micromachined air-suspended inductors

AU - Choi, Yun Seok

AU - Yoon, Euisik

AU - Yoon, Jun Bo

PY - 2003/8/18

Y1 - 2003/8/18

N2 - We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20% degradation of integrated inductor Q-factor has been observed.

AB - We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20% degradation of integrated inductor Q-factor has been observed.

UR - http://www.scopus.com/inward/record.url?scp=0043093729&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0043093729&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0043093729

VL - 3

SP - 1637

EP - 1640

JO - IEEE MTT-S International Microwave Symposium Digest

JF - IEEE MTT-S International Microwave Symposium Digest

SN - 0149-645X

T2 - 2003 IEEE MTT-S International Microwave Symposium Digest

Y2 - 8 June 2003 through 13 June 2003

ER -