Encapsulation of the micromachined air-suspended inductors

Yun Seok Choi, Euisik Yoon, Jun Bo Yoon

Research output: Contribution to journalConference article

6 Citations (Scopus)

Abstract

We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20% degradation of integrated inductor Q-factor has been observed.

Original languageEnglish
Pages (from-to)1637-1640
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume3
Publication statusPublished - 2003 Aug 18
Event2003 IEEE MTT-S International Microwave Symposium Digest - Philadelphia, PA, United States
Duration: 2003 Jun 82003 Jun 13

Fingerprint

inductors
Polydimethylsiloxane
Encapsulation
degradation
Degradation
encapsulating
air
Air
integrated circuits
Integrated circuits
Q factors
radio frequencies
coverings
Permittivity
shock
permittivity
Silicon
vibration
microstructure
Microstructure

All Science Journal Classification (ASJC) codes

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

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title = "Encapsulation of the micromachined air-suspended inductors",
abstract = "We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20{\%} degradation of integrated inductor Q-factor has been observed.",
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Encapsulation of the micromachined air-suspended inductors. / Choi, Yun Seok; Yoon, Euisik; Yoon, Jun Bo.

In: IEEE MTT-S International Microwave Symposium Digest, Vol. 3, 18.08.2003, p. 1637-1640.

Research output: Contribution to journalConference article

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AB - We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20% degradation of integrated inductor Q-factor has been observed.

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