Abstract
We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20% degradation of integrated inductor Q-factor has been observed.
| Original language | English |
|---|---|
| Pages (from-to) | 1637-1640 |
| Number of pages | 4 |
| Journal | IEEE MTT-S International Microwave Symposium Digest |
| Volume | 3 |
| Publication status | Published - 2003 Aug 18 |
| Event | 2003 IEEE MTT-S International Microwave Symposium Digest - Philadelphia, PA, United States Duration: 2003 Jun 8 → 2003 Jun 13 |
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All Science Journal Classification (ASJC) codes
- Radiation
- Condensed Matter Physics
- Electrical and Electronic Engineering
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Encapsulation of the micromachined air-suspended inductors. / Choi, Yun Seok; Yoon, Euisik; Yoon, Jun Bo.
In: IEEE MTT-S International Microwave Symposium Digest, Vol. 3, 18.08.2003, p. 1637-1640.Research output: Contribution to journal › Conference article
TY - JOUR
T1 - Encapsulation of the micromachined air-suspended inductors
AU - Choi, Yun Seok
AU - Yoon, Euisik
AU - Yoon, Jun Bo
PY - 2003/8/18
Y1 - 2003/8/18
N2 - We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20% degradation of integrated inductor Q-factor has been observed.
AB - We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20% degradation of integrated inductor Q-factor has been observed.
UR - http://www.scopus.com/inward/record.url?scp=0043093729&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0043093729&partnerID=8YFLogxK
M3 - Conference article
AN - SCOPUS:0043093729
VL - 3
SP - 1637
EP - 1640
JO - IEEE MTT-S International Microwave Symposium Digest
JF - IEEE MTT-S International Microwave Symposium Digest
SN - 0149-645X
ER -