Abstract
We have proposed and investigated encapsulation of air-suspended microstructures, especially for micromachined inductors in silicon radio frequency integrated circuits (RF ICs), providing a practical solution for covering up structural weakness to shock/vibration and accommodating package processes. As an encapsulating agent, two materials have been studied; polydimethylsiloxane (PDMS) for examining possible structural deformation when spin-coated, and benzocyclobutene (BCB) for measuring possible electrical performance degradation due to the finite dielectric constant. According to the experiments, no structural deformation has been observed after PDMS is spin-coated. After encapsulated by BCB, the maximum 20% degradation of integrated inductor Q-factor has been observed.
Original language | English |
---|---|
Pages (from-to) | 1637-1640 |
Number of pages | 4 |
Journal | IEEE MTT-S International Microwave Symposium Digest |
Volume | 3 |
Publication status | Published - 2003 |
Event | 2003 IEEE MTT-S International Microwave Symposium Digest - Philadelphia, PA, United States Duration: 2003 Jun 8 → 2003 Jun 13 |
All Science Journal Classification (ASJC) codes
- Radiation
- Condensed Matter Physics
- Electrical and Electronic Engineering