Conventional dynamic thermal management (DTM) assumes that the thermal resistance of a heat-sink is a given constant determined at design time. However, the thermal resistance of a common forced-convection heat sink is inversely proportional to the flow rate of the air or coolant at the expense of the cooling power consumption. The die temperature of the silicon devices strongly affects its leakage power consumption and reliability, and it can be changed by adjusting the thermal resistance of the cooling devices. Different from conventional DTM which aims to avoid the thermal emergency, our proposed DTM regards the thermal resistance of a forced-convection heat sink as a control variable, and minimize the total power consumption both for computation and cooling. We control the cooling power consumption together with the microprocessor clock frequency and supply voltage, and track the energy-optimal die temperature. Consequently, we reduce a significant amount of the temperature-dependent leakage power consumption of the microprocessor while spending a bit higher cooling power than conventional DTM, and eventually consume less total power. Experimental results show the proposed DTM saves up to 8.2% of the total energy compared with a baseline DTM approach. Our proposed DTM also enhances the Failures in Time (FIT) up to 80% in terms of the electromigration lifetime reliability.
Bibliographical noteFunding Information:
Manuscript received November 25, 2009; revised May 07, 2010; accepted May 26, 2010. Date of publication June 28, 2010; date of current version August 06, 2010. This work was supported in part by the Brain Korea 21 Project, in part by the ’National Research Foundation of Korea (NRF) grant funded by the Korean government (MEST) under Grant 2009-0060054 and Grant 2010-0017680, in part by the Korea Research Foundation Grant funded by the Korean Government (KRF-2009-013-D00099), and in part by the IC Design Education Center (IDEC). The ICT at Seoul National University provides research facilities for this study. This paper was presented in part at the 2009 International Conference on Computer-Aided Design (ICCAD), San Jose, CA. Paper no. TII-09-11-0341.
All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Information Systems
- Computer Science Applications
- Electrical and Electronic Engineering