Energy-optimal dynamic thermal management

Computation and cooling power co-optimization

Donghwa Shin, Sung Woo Chung, Eui-Young Chung, Naehyuck Chang

Research output: Contribution to journalArticle

43 Citations (Scopus)

Abstract

Conventional dynamic thermal management (DTM) assumes that the thermal resistance of a heat-sink is a given constant determined at design time. However, the thermal resistance of a common forced-convection heat sink is inversely proportional to the flow rate of the air or coolant at the expense of the cooling power consumption. The die temperature of the silicon devices strongly affects its leakage power consumption and reliability, and it can be changed by adjusting the thermal resistance of the cooling devices. Different from conventional DTM which aims to avoid the thermal emergency, our proposed DTM regards the thermal resistance of a forced-convection heat sink as a control variable, and minimize the total power consumption both for computation and cooling. We control the cooling power consumption together with the microprocessor clock frequency and supply voltage, and track the energy-optimal die temperature. Consequently, we reduce a significant amount of the temperature-dependent leakage power consumption of the microprocessor while spending a bit higher cooling power than conventional DTM, and eventually consume less total power. Experimental results show the proposed DTM saves up to 8.2% of the total energy compared with a baseline DTM approach. Our proposed DTM also enhances the Failures in Time (FIT) up to 80% in terms of the electromigration lifetime reliability.

Original languageEnglish
Article number5497141
Pages (from-to)340-351
Number of pages12
JournalIEEE Transactions on Industrial Informatics
Volume6
Issue number3
DOIs
Publication statusPublished - 2010 Aug 1

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Cooling
Electric power utilization
Heat resistance
Heat sinks
Forced convection
Microprocessor chips
Electromigration
Thermal management (electronics)
Coolants
Temperature
Clocks
Flow rate
Silicon
Electric potential
Air

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Information Systems
  • Computer Science Applications
  • Electrical and Electronic Engineering

Cite this

@article{ebad8cc7c58c4fa7a4a041d80606a004,
title = "Energy-optimal dynamic thermal management: Computation and cooling power co-optimization",
abstract = "Conventional dynamic thermal management (DTM) assumes that the thermal resistance of a heat-sink is a given constant determined at design time. However, the thermal resistance of a common forced-convection heat sink is inversely proportional to the flow rate of the air or coolant at the expense of the cooling power consumption. The die temperature of the silicon devices strongly affects its leakage power consumption and reliability, and it can be changed by adjusting the thermal resistance of the cooling devices. Different from conventional DTM which aims to avoid the thermal emergency, our proposed DTM regards the thermal resistance of a forced-convection heat sink as a control variable, and minimize the total power consumption both for computation and cooling. We control the cooling power consumption together with the microprocessor clock frequency and supply voltage, and track the energy-optimal die temperature. Consequently, we reduce a significant amount of the temperature-dependent leakage power consumption of the microprocessor while spending a bit higher cooling power than conventional DTM, and eventually consume less total power. Experimental results show the proposed DTM saves up to 8.2{\%} of the total energy compared with a baseline DTM approach. Our proposed DTM also enhances the Failures in Time (FIT) up to 80{\%} in terms of the electromigration lifetime reliability.",
author = "Donghwa Shin and Chung, {Sung Woo} and Eui-Young Chung and Naehyuck Chang",
year = "2010",
month = "8",
day = "1",
doi = "10.1109/TII.2010.2052059",
language = "English",
volume = "6",
pages = "340--351",
journal = "IEEE Transactions on Industrial Informatics",
issn = "1551-3203",
publisher = "IEEE Computer Society",
number = "3",

}

Energy-optimal dynamic thermal management : Computation and cooling power co-optimization. / Shin, Donghwa; Chung, Sung Woo; Chung, Eui-Young; Chang, Naehyuck.

In: IEEE Transactions on Industrial Informatics, Vol. 6, No. 3, 5497141, 01.08.2010, p. 340-351.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Energy-optimal dynamic thermal management

T2 - Computation and cooling power co-optimization

AU - Shin, Donghwa

AU - Chung, Sung Woo

AU - Chung, Eui-Young

AU - Chang, Naehyuck

PY - 2010/8/1

Y1 - 2010/8/1

N2 - Conventional dynamic thermal management (DTM) assumes that the thermal resistance of a heat-sink is a given constant determined at design time. However, the thermal resistance of a common forced-convection heat sink is inversely proportional to the flow rate of the air or coolant at the expense of the cooling power consumption. The die temperature of the silicon devices strongly affects its leakage power consumption and reliability, and it can be changed by adjusting the thermal resistance of the cooling devices. Different from conventional DTM which aims to avoid the thermal emergency, our proposed DTM regards the thermal resistance of a forced-convection heat sink as a control variable, and minimize the total power consumption both for computation and cooling. We control the cooling power consumption together with the microprocessor clock frequency and supply voltage, and track the energy-optimal die temperature. Consequently, we reduce a significant amount of the temperature-dependent leakage power consumption of the microprocessor while spending a bit higher cooling power than conventional DTM, and eventually consume less total power. Experimental results show the proposed DTM saves up to 8.2% of the total energy compared with a baseline DTM approach. Our proposed DTM also enhances the Failures in Time (FIT) up to 80% in terms of the electromigration lifetime reliability.

AB - Conventional dynamic thermal management (DTM) assumes that the thermal resistance of a heat-sink is a given constant determined at design time. However, the thermal resistance of a common forced-convection heat sink is inversely proportional to the flow rate of the air or coolant at the expense of the cooling power consumption. The die temperature of the silicon devices strongly affects its leakage power consumption and reliability, and it can be changed by adjusting the thermal resistance of the cooling devices. Different from conventional DTM which aims to avoid the thermal emergency, our proposed DTM regards the thermal resistance of a forced-convection heat sink as a control variable, and minimize the total power consumption both for computation and cooling. We control the cooling power consumption together with the microprocessor clock frequency and supply voltage, and track the energy-optimal die temperature. Consequently, we reduce a significant amount of the temperature-dependent leakage power consumption of the microprocessor while spending a bit higher cooling power than conventional DTM, and eventually consume less total power. Experimental results show the proposed DTM saves up to 8.2% of the total energy compared with a baseline DTM approach. Our proposed DTM also enhances the Failures in Time (FIT) up to 80% in terms of the electromigration lifetime reliability.

UR - http://www.scopus.com/inward/record.url?scp=77955706086&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77955706086&partnerID=8YFLogxK

U2 - 10.1109/TII.2010.2052059

DO - 10.1109/TII.2010.2052059

M3 - Article

VL - 6

SP - 340

EP - 351

JO - IEEE Transactions on Industrial Informatics

JF - IEEE Transactions on Industrial Informatics

SN - 1551-3203

IS - 3

M1 - 5497141

ER -