Energy-optimal dynamic thermal management for green computing

Donghwa Shin, Jihun Kim, Naehyuck Chang, Jinhang Choi, Sung Woo Chung, Eui-Young Chung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

24 Citations (Scopus)

Abstract

Existing thermal management systems for microprocessors assume that the thermal resistance of the heat-sink is constant and that the objective of the cooling system is simply to avoid thermal emergencies. But in fact the thermal resistance of the usual forced-convection heat-sink is inversely proportional to the fan speed, and a more rational objective is to minimize the total power consumption of both processor and cooling system. Our new method of dynamic thermal management uses both the fan speed and the voltage/frequency of the microprocessor as control variables. Experiments show that tracking the energy-optimal steady-state temperature can saves up to 17.6% of the overall energy, when compared with a conventional approach that merely avoids over-heating.

Original languageEnglish
Title of host publicationProceedings of the 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers, ICCAD 2009
Pages652-657
Number of pages6
Publication statusPublished - 2009 Dec 1
Event2009 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2009 - San Jose, CA, United States
Duration: 2009 Nov 22009 Nov 5

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN (Print)1092-3152

Other

Other2009 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2009
CountryUnited States
CitySan Jose, CA
Period09/11/209/11/5

Fingerprint

Heat sinks
Cooling systems
Heat resistance
Temperature control
Fans
Microprocessor chips
Forced convection
Electric power utilization
Heating
Electric potential
Experiments
Temperature
Green computing
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Software
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

Cite this

Shin, D., Kim, J., Chang, N., Choi, J., Chung, S. W., & Chung, E-Y. (2009). Energy-optimal dynamic thermal management for green computing. In Proceedings of the 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers, ICCAD 2009 (pp. 652-657). [5361225] (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).
Shin, Donghwa ; Kim, Jihun ; Chang, Naehyuck ; Choi, Jinhang ; Chung, Sung Woo ; Chung, Eui-Young. / Energy-optimal dynamic thermal management for green computing. Proceedings of the 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers, ICCAD 2009. 2009. pp. 652-657 (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).
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Shin, D, Kim, J, Chang, N, Choi, J, Chung, SW & Chung, E-Y 2009, Energy-optimal dynamic thermal management for green computing. in Proceedings of the 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers, ICCAD 2009., 5361225, IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD, pp. 652-657, 2009 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2009, San Jose, CA, United States, 09/11/2.

Energy-optimal dynamic thermal management for green computing. / Shin, Donghwa; Kim, Jihun; Chang, Naehyuck; Choi, Jinhang; Chung, Sung Woo; Chung, Eui-Young.

Proceedings of the 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers, ICCAD 2009. 2009. p. 652-657 5361225 (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Shin D, Kim J, Chang N, Choi J, Chung SW, Chung E-Y. Energy-optimal dynamic thermal management for green computing. In Proceedings of the 2009 IEEE/ACM International Conference on Computer-Aided Design - Digest of Technical Papers, ICCAD 2009. 2009. p. 652-657. 5361225. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).