Enhanced electrical properties of epoxy resin with high adhesion

Eun Yong Lee, Il Seok Chae, Jinkee Hong, Sang Wook Kang

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

In search of small dielectric constant (Dk) and low-dissipation (Df) energy substrates for high-frequency appliances, a benzoate-group-substituted bisphenol A based resin was synthesized from bisphenol A dibenzolate and bisphenol A diglycidyl ether. Compared to the common bisphenol A diglycidyl ether epoxy resin, introduction of the benzoate group was considered to lead to increased hydrophobic character, which was supported by water absorption investigation as well as absorption peak investigation of the OH region via Fourier transform infrared spectra. The cured resin with few water molecules exhibited restricted motion of the segment, and, consequently, thermally stable properties (coefficient of thermal expansion and thermogravimetric analysis) were achieved. Ultimately, the developed epoxy resin showed dramatically reduced Dk (3.05 at 1 GHz) and Df (0.016 at 1 GHz) values as well as enhanced adhesive properties. The excellent overall properties lead to its promising use in various fields involving electrical devices.

Original languageEnglish
Pages (from-to)15713-15717
Number of pages5
JournalIndustrial and Engineering Chemistry Research
Volume52
Issue number45
DOIs
Publication statusPublished - 2013 Nov 13

Fingerprint

Epoxy Resins
Benzoates
Epoxy resins
Ethers
Electric properties
Adhesion
Resins
Water absorption
Thermal expansion
Thermogravimetric analysis
Energy dissipation
Adhesives
Fourier transforms
Permittivity
Infrared radiation
Molecules
Water
Substrates
2,2-bis(4-glycidyloxyphenyl)propane
bisphenol A

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Chemical Engineering(all)
  • Industrial and Manufacturing Engineering

Cite this

Lee, Eun Yong ; Chae, Il Seok ; Hong, Jinkee ; Kang, Sang Wook. / Enhanced electrical properties of epoxy resin with high adhesion. In: Industrial and Engineering Chemistry Research. 2013 ; Vol. 52, No. 45. pp. 15713-15717.
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Enhanced electrical properties of epoxy resin with high adhesion. / Lee, Eun Yong; Chae, Il Seok; Hong, Jinkee; Kang, Sang Wook.

In: Industrial and Engineering Chemistry Research, Vol. 52, No. 45, 13.11.2013, p. 15713-15717.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Enhanced electrical properties of epoxy resin with high adhesion

AU - Lee, Eun Yong

AU - Chae, Il Seok

AU - Hong, Jinkee

AU - Kang, Sang Wook

PY - 2013/11/13

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N2 - In search of small dielectric constant (Dk) and low-dissipation (Df) energy substrates for high-frequency appliances, a benzoate-group-substituted bisphenol A based resin was synthesized from bisphenol A dibenzolate and bisphenol A diglycidyl ether. Compared to the common bisphenol A diglycidyl ether epoxy resin, introduction of the benzoate group was considered to lead to increased hydrophobic character, which was supported by water absorption investigation as well as absorption peak investigation of the OH region via Fourier transform infrared spectra. The cured resin with few water molecules exhibited restricted motion of the segment, and, consequently, thermally stable properties (coefficient of thermal expansion and thermogravimetric analysis) were achieved. Ultimately, the developed epoxy resin showed dramatically reduced Dk (3.05 at 1 GHz) and Df (0.016 at 1 GHz) values as well as enhanced adhesive properties. The excellent overall properties lead to its promising use in various fields involving electrical devices.

AB - In search of small dielectric constant (Dk) and low-dissipation (Df) energy substrates for high-frequency appliances, a benzoate-group-substituted bisphenol A based resin was synthesized from bisphenol A dibenzolate and bisphenol A diglycidyl ether. Compared to the common bisphenol A diglycidyl ether epoxy resin, introduction of the benzoate group was considered to lead to increased hydrophobic character, which was supported by water absorption investigation as well as absorption peak investigation of the OH region via Fourier transform infrared spectra. The cured resin with few water molecules exhibited restricted motion of the segment, and, consequently, thermally stable properties (coefficient of thermal expansion and thermogravimetric analysis) were achieved. Ultimately, the developed epoxy resin showed dramatically reduced Dk (3.05 at 1 GHz) and Df (0.016 at 1 GHz) values as well as enhanced adhesive properties. The excellent overall properties lead to its promising use in various fields involving electrical devices.

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