Enhanced Fracture Resistance of Flexible ZnO:Al Thin Films in Situ Sputtered on Bent Polymer Substrates

Hong Rak Choi, Senthil Kumar Eswaran, Seung Min Lee, Yong Soo Cho

Research output: Contribution to journalArticle

24 Citations (Scopus)

Abstract

Improving the fracture resistance of inorganic thin films is one of the key challenges in flexible electronic devices. A nonconventional in situ sputtering method is introduced to induce residual compressive stress in ZnO:Al thin films during deposition on a bent polymer substrate. The films grown under a larger prebending strain resulted in a higher fracture resistance to applied strains by exhibiting a ∼ 70% improvement in crack-initiating critical strain compared with the reference sample grown without bending. This significant improvement is attributed to the induced residual stress, which helps to prevent the formation of cracks by counteracting the applied strain.

Original languageEnglish
Pages (from-to)17569-17572
Number of pages4
JournalACS Applied Materials and Interfaces
Volume7
Issue number32
DOIs
Publication statusPublished - 2015 Aug 19

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Fracture toughness
Polymers
Thin films
Substrates
Residual stresses
Flexible electronics
Cracks
Compressive stress
Sputtering

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

Cite this

Choi, Hong Rak ; Eswaran, Senthil Kumar ; Lee, Seung Min ; Cho, Yong Soo. / Enhanced Fracture Resistance of Flexible ZnO:Al Thin Films in Situ Sputtered on Bent Polymer Substrates. In: ACS Applied Materials and Interfaces. 2015 ; Vol. 7, No. 32. pp. 17569-17572.
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Enhanced Fracture Resistance of Flexible ZnO:Al Thin Films in Situ Sputtered on Bent Polymer Substrates. / Choi, Hong Rak; Eswaran, Senthil Kumar; Lee, Seung Min; Cho, Yong Soo.

In: ACS Applied Materials and Interfaces, Vol. 7, No. 32, 19.08.2015, p. 17569-17572.

Research output: Contribution to journalArticle

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