Incorporation of a foreign element is considered as a promising approach to enhance the performance of thermoelectric materials since this can either improve the power factor by a band structure modification or reduce the thermal conductivity by a phonon scattering strengthening. We fabricated the polycrystalline bulk samples of Cu-incorporated Bi0.5Sb1.5Te3 by melt spinning and spark plasma sintering, and evaluated the electronic and thermal transport properties. From the phase analysis and thermoelectric properties measurement, we found that most of the added excess Cu atoms were substituted at a Sb-site and a small amount of Cu was intercalated at the van der Waals gap between quintuple layers. By the formation of two different point defects (substituted Cu and intercalated Cu), the thermoelectric power factor was enhanced because of the increased density of states effective mass, and simultaneously reduced thermal conductivity originated from the intensified phonon scattering and suppressed bipolar contribution. Maximum thermoelectric figure of merit zT of 1.13 was obtained at 400 K.
|Number of pages||5|
|Journal||Journal of Electronic Materials|
|Publication status||Published - 2020 May 1|
Bibliographical noteFunding Information:
Thermoelectric Cu-incorporation Bi 0.5 Sb 1.5 Te 3 melt spinning spark plasma sintering Korean National Research Funds NRF-2019R1C1C1005254 NRF-2019R1A6A1A11055660 Kim Sang-il Lee Kyu Hyoung Hongik University http://dx.doi.org/10.13039/501100002496 New faculty research support fund Kim Hyun-sik publisher-imprint-name Springer article-contains-esm No article-numbering-style Unnumbered article-registration-date-year 2019 article-registration-date-month 10 article-registration-date-day 25 article-toc-levels 0 journal-product NonStandardArchiveJournal numbering-style Unnumbered article-grants-type Regular metadata-grant OpenAccess abstract-grant OpenAccess bodypdf-grant Restricted bodyhtml-grant Restricted bibliography-grant Restricted esm-grant OpenAccess online-first true pdf-file-reference BodyRef/PDF/11664_2019_Article_7772.pdf target-type OnlinePDF article-type OriginalPaper journal-subject-primary Materials Science journal-subject-secondary Optical and Electronic Materials journal-subject-secondary Characterization and Evaluation of Materials journal-subject-secondary Electronics and Microelectronics, Instrumentation journal-subject-secondary Solid State Physics journal-subject-collection Chemistry and Materials Science open-access false Hyun-jun Cho and Hyun-sik Kim have contributed equally to this study.
This study was supported by a grant from the Korean National Research Funds (NRF-2019R1C1C1005254). This work was supported by the HongikUniversity newfaculty research support fund. This research was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by theMinistry of Education (NRF-2019R1A6A1A11055660).
This study was supported by a grant from the Korean National Research Funds (NRF-2019R1C1C1005254). This work was supported by the HongikUniversity newfaculty research support fund. This research was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by theMinistry of Education (NRF-2019R1A6A1A11055660). Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
© 2019, The Minerals, Metals & Materials Society.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry