Enhancement of the thermal conductivity of adhesives for wood flooring using xGnP

Jungki Seo, Junghoon Cha, Sumin Kim

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)


Using exfoliated graphite nanoplatelets (xGnP), resin/xGnP composites were prepared by stirring xGnP in the epoxy resin with hardener and polyurethane(PU) resin to increase the thermal conductivity of an under-floor heating system using wood flooring. xGnP of 1, 2 and 3 wt% was added to pure epoxy and PU resin at room temperature. The thermal conductivity of resin/xGnP composites was increased with the increased with the increase of xGnP loading contents. Also, the increased bonding strength of epoxy/xGnP composite was manifested in the results of a single lap shearing test. Harden resin/xGnP composites showed endothermic energy curves according to thermal conductivity by differential scanning calorimeter (DSC) measurement. Resin/xGnP composites showed higher thermal conductivity than pure resins and absorbed less energy than pure resins with increasing temperature. Applying xGnP to the installation resin of wood flooring cannot only be effective in increasing the thermal conductivity of installation resin but is also inexpensive, has easy dispersion and good mechanical properties.

Original languageEnglish
Pages (from-to)153-156
Number of pages4
JournalEnergy and Buildings
Publication statusPublished - 2012 Aug

Bibliographical note

Funding Information:
This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education, Science and Technology (No. 225 2011-0004181). This research was supported by Bio-industry Technology Development Program, Ministry for Food, Agriculture, Forestry and Fisheries, Republic of Korea.

All Science Journal Classification (ASJC) codes

  • Civil and Structural Engineering
  • Building and Construction
  • Mechanical Engineering
  • Electrical and Electronic Engineering


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