Enhancement of thermoelectric figure of merit for Bi 0.5Sb 1.5Te 3 by metal nanoparticle decoration

Kyu Hyoung Lee; Hyun Sik Kim; Sang Il Kim; Eun Sung Lee; Sang Mock Lee; Jong Soo Rhyee; Jae Yong Jung; Il Ho Kim; Yifeng Wang; Kunihito Koumoto

doi:10.1007/s11664-012-1913-0

Enhancement of thermoelectric figure of merit for Bi _0.5Sb _1.5Te ₃ by metal nanoparticle decoration

Kyu Hyoung Lee, Hyun Sik Kim, Sang Il Kim, Eun Sung Lee, Sang Mock Lee, Jong Soo Rhyee, Jae Yong Jung, Il Ho Kim, Yifeng Wang, Kunihito Koumoto

Department of Materials Science and Engineering

Research output: Contribution to journal › Article

48 Citations (Scopus)

Abstract

Introducing nanoinclusions in thermoelectric (TE) materials is expected to lower the lattice thermal conductivity by intensifying the phonon scattering effect, thus enhancing their TE figure of merit ZT. We report a novel method of fabricating Bi _0.5Sb _1.5Te ₃ nanocomposite with nanoscale metal particles by using metal acetate precursor, which is low cost and facile to scale up for mass production. Ag and Cu particles of ∼40 nm were successfully near-monodispersed at grain boundaries of Bi _0.5Sb _1.5Te ₃ matrix. The well-dispersed metal nanoparticles reduce the lattice thermal conductivity extensively, while enhancing the power factor. Consequently, ZT was enhanced by more than 25% near room temperature and by more than 300% at 520 K compared with a Bi _0.5Sb _1.5Te ₃ reference sample. The peak ZT of 1.35 was achieved at 400 K for 0.1 wt.% Cu-decorated Bi _0.5Sb _1.5Te ₃.

Original language	English
Pages (from-to)	1165-1169
Number of pages	5
Journal	Journal of Electronic Materials
Volume	41
Issue number	6
DOIs	https://doi.org/10.1007/s11664-012-1913-0
Publication status	Published - 2012 Jun 1

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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Lee, K. H., Kim, H. S., Kim, S. I., Lee, E. S., Lee, S. M., Rhyee, J. S., Jung, J. Y., Kim, I. H., Wang, Y., & Koumoto, K. (2012). Enhancement of thermoelectric figure of merit for Bi _0.5Sb _1.5Te ₃ by metal nanoparticle decoration. Journal of Electronic Materials, 41(6), 1165-1169. https://doi.org/10.1007/s11664-012-1913-0

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abstract = "Introducing nanoinclusions in thermoelectric (TE) materials is expected to lower the lattice thermal conductivity by intensifying the phonon scattering effect, thus enhancing their TE figure of merit ZT. We report a novel method of fabricating Bi 0.5Sb 1.5Te 3 nanocomposite with nanoscale metal particles by using metal acetate precursor, which is low cost and facile to scale up for mass production. Ag and Cu particles of ∼40 nm were successfully near-monodispersed at grain boundaries of Bi 0.5Sb 1.5Te 3 matrix. The well-dispersed metal nanoparticles reduce the lattice thermal conductivity extensively, while enhancing the power factor. Consequently, ZT was enhanced by more than 25% near room temperature and by more than 300% at 520 K compared with a Bi 0.5Sb 1.5Te 3 reference sample. The peak ZT of 1.35 was achieved at 400 K for 0.1 wt.% Cu-decorated Bi 0.5Sb 1.5Te 3.",

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Enhancement of thermoelectric figure of merit for Bi _0.5Sb _1.5Te ₃ by metal nanoparticle decoration. / Lee, Kyu Hyoung; Kim, Hyun Sik; Kim, Sang Il; Lee, Eun Sung; Lee, Sang Mock; Rhyee, Jong Soo; Jung, Jae Yong; Kim, Il Ho; Wang, Yifeng; Koumoto, Kunihito.

In: Journal of Electronic Materials, Vol. 41, No. 6, 01.06.2012, p. 1165-1169.

Research output: Contribution to journal › Article

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AU - Lee, Kyu Hyoung

AU - Kim, Hyun Sik

AU - Kim, Sang Il

AU - Lee, Eun Sung

AU - Lee, Sang Mock

AU - Rhyee, Jong Soo

AU - Jung, Jae Yong

AU - Kim, Il Ho

AU - Wang, Yifeng

AU - Koumoto, Kunihito

PY - 2012/6/1

Y1 - 2012/6/1

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