Enhancement of thermoelectric figure of merit for Bi 0.5Sb 1.5Te 3 by metal nanoparticle decoration

Kyu Hyoung Lee, Hyun Sik Kim, Sang Il Kim, Eun Sung Lee, Sang Mock Lee, Jong Soo Rhyee, Jae Yong Jung, Il Ho Kim, Yifeng Wang, Kunihito Koumoto

Research output: Contribution to journalArticle

41 Citations (Scopus)

Abstract

Introducing nanoinclusions in thermoelectric (TE) materials is expected to lower the lattice thermal conductivity by intensifying the phonon scattering effect, thus enhancing their TE figure of merit ZT. We report a novel method of fabricating Bi 0.5Sb 1.5Te 3 nanocomposite with nanoscale metal particles by using metal acetate precursor, which is low cost and facile to scale up for mass production. Ag and Cu particles of ∼40 nm were successfully near-monodispersed at grain boundaries of Bi 0.5Sb 1.5Te 3 matrix. The well-dispersed metal nanoparticles reduce the lattice thermal conductivity extensively, while enhancing the power factor. Consequently, ZT was enhanced by more than 25% near room temperature and by more than 300% at 520 K compared with a Bi 0.5Sb 1.5Te 3 reference sample. The peak ZT of 1.35 was achieved at 400 K for 0.1 wt.% Cu-decorated Bi 0.5Sb 1.5Te 3.

Original languageEnglish
Pages (from-to)1165-1169
Number of pages5
JournalJournal of Electronic Materials
Volume41
Issue number6
DOIs
Publication statusPublished - 2012 Jun 1

Fingerprint

Metal nanoparticles
figure of merit
Thermal conductivity
thermal conductivity
Metals
nanoparticles
Phonon scattering
thermoelectric materials
augmentation
metal particles
metals
acetates
Nanocomposites
nanocomposites
Grain boundaries
Acetates
grain boundaries
room temperature
matrices
scattering

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Lee, Kyu Hyoung ; Kim, Hyun Sik ; Kim, Sang Il ; Lee, Eun Sung ; Lee, Sang Mock ; Rhyee, Jong Soo ; Jung, Jae Yong ; Kim, Il Ho ; Wang, Yifeng ; Koumoto, Kunihito. / Enhancement of thermoelectric figure of merit for Bi 0.5Sb 1.5Te 3 by metal nanoparticle decoration. In: Journal of Electronic Materials. 2012 ; Vol. 41, No. 6. pp. 1165-1169.
@article{b7ecaad5dc714af796c4ecc8613b1547,
title = "Enhancement of thermoelectric figure of merit for Bi 0.5Sb 1.5Te 3 by metal nanoparticle decoration",
abstract = "Introducing nanoinclusions in thermoelectric (TE) materials is expected to lower the lattice thermal conductivity by intensifying the phonon scattering effect, thus enhancing their TE figure of merit ZT. We report a novel method of fabricating Bi 0.5Sb 1.5Te 3 nanocomposite with nanoscale metal particles by using metal acetate precursor, which is low cost and facile to scale up for mass production. Ag and Cu particles of ∼40 nm were successfully near-monodispersed at grain boundaries of Bi 0.5Sb 1.5Te 3 matrix. The well-dispersed metal nanoparticles reduce the lattice thermal conductivity extensively, while enhancing the power factor. Consequently, ZT was enhanced by more than 25{\%} near room temperature and by more than 300{\%} at 520 K compared with a Bi 0.5Sb 1.5Te 3 reference sample. The peak ZT of 1.35 was achieved at 400 K for 0.1 wt.{\%} Cu-decorated Bi 0.5Sb 1.5Te 3.",
author = "Lee, {Kyu Hyoung} and Kim, {Hyun Sik} and Kim, {Sang Il} and Lee, {Eun Sung} and Lee, {Sang Mock} and Rhyee, {Jong Soo} and Jung, {Jae Yong} and Kim, {Il Ho} and Yifeng Wang and Kunihito Koumoto",
year = "2012",
month = "6",
day = "1",
doi = "10.1007/s11664-012-1913-0",
language = "English",
volume = "41",
pages = "1165--1169",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",
number = "6",

}

Lee, KH, Kim, HS, Kim, SI, Lee, ES, Lee, SM, Rhyee, JS, Jung, JY, Kim, IH, Wang, Y & Koumoto, K 2012, 'Enhancement of thermoelectric figure of merit for Bi 0.5Sb 1.5Te 3 by metal nanoparticle decoration', Journal of Electronic Materials, vol. 41, no. 6, pp. 1165-1169. https://doi.org/10.1007/s11664-012-1913-0

Enhancement of thermoelectric figure of merit for Bi 0.5Sb 1.5Te 3 by metal nanoparticle decoration. / Lee, Kyu Hyoung; Kim, Hyun Sik; Kim, Sang Il; Lee, Eun Sung; Lee, Sang Mock; Rhyee, Jong Soo; Jung, Jae Yong; Kim, Il Ho; Wang, Yifeng; Koumoto, Kunihito.

In: Journal of Electronic Materials, Vol. 41, No. 6, 01.06.2012, p. 1165-1169.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Enhancement of thermoelectric figure of merit for Bi 0.5Sb 1.5Te 3 by metal nanoparticle decoration

AU - Lee, Kyu Hyoung

AU - Kim, Hyun Sik

AU - Kim, Sang Il

AU - Lee, Eun Sung

AU - Lee, Sang Mock

AU - Rhyee, Jong Soo

AU - Jung, Jae Yong

AU - Kim, Il Ho

AU - Wang, Yifeng

AU - Koumoto, Kunihito

PY - 2012/6/1

Y1 - 2012/6/1

N2 - Introducing nanoinclusions in thermoelectric (TE) materials is expected to lower the lattice thermal conductivity by intensifying the phonon scattering effect, thus enhancing their TE figure of merit ZT. We report a novel method of fabricating Bi 0.5Sb 1.5Te 3 nanocomposite with nanoscale metal particles by using metal acetate precursor, which is low cost and facile to scale up for mass production. Ag and Cu particles of ∼40 nm were successfully near-monodispersed at grain boundaries of Bi 0.5Sb 1.5Te 3 matrix. The well-dispersed metal nanoparticles reduce the lattice thermal conductivity extensively, while enhancing the power factor. Consequently, ZT was enhanced by more than 25% near room temperature and by more than 300% at 520 K compared with a Bi 0.5Sb 1.5Te 3 reference sample. The peak ZT of 1.35 was achieved at 400 K for 0.1 wt.% Cu-decorated Bi 0.5Sb 1.5Te 3.

AB - Introducing nanoinclusions in thermoelectric (TE) materials is expected to lower the lattice thermal conductivity by intensifying the phonon scattering effect, thus enhancing their TE figure of merit ZT. We report a novel method of fabricating Bi 0.5Sb 1.5Te 3 nanocomposite with nanoscale metal particles by using metal acetate precursor, which is low cost and facile to scale up for mass production. Ag and Cu particles of ∼40 nm were successfully near-monodispersed at grain boundaries of Bi 0.5Sb 1.5Te 3 matrix. The well-dispersed metal nanoparticles reduce the lattice thermal conductivity extensively, while enhancing the power factor. Consequently, ZT was enhanced by more than 25% near room temperature and by more than 300% at 520 K compared with a Bi 0.5Sb 1.5Te 3 reference sample. The peak ZT of 1.35 was achieved at 400 K for 0.1 wt.% Cu-decorated Bi 0.5Sb 1.5Te 3.

UR - http://www.scopus.com/inward/record.url?scp=84862788720&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84862788720&partnerID=8YFLogxK

U2 - 10.1007/s11664-012-1913-0

DO - 10.1007/s11664-012-1913-0

M3 - Article

VL - 41

SP - 1165

EP - 1169

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 6

ER -