Enhancing the thermoelectric properties of p-type bulk Bi-Sb-Te nanocomposites via solution-based metal nanoparticle decoration

Sungwoo Hwang, Sang Il Kim, Kyunghan Ahn, Jong Wook Roh, Dae Jin Yang, Sang Mock Lee, Kyu Hyoung Lee

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

Embedding nanosized particles in bulk thermoelectric materials is expected to lower the lattice thermal conductivity by enhancing the degree of interface phonon scattering, thus improving their thermoelectric figure of merit ZT. We have developed a wet chemical process to fabricate Bi0.5Sb 1.5Te3-based thermoelectric nanocomposites which include nanometer-sized metal particles. By simple solution mixing of metal acetate precursors and Bi0.5Sb1.5Te3 powders in ethyl acetate as a medium for homogeneous incorporation, it is possible to apply various types of metal nanoparticles onto the surfaces of the thermoelectric powders. Next, bulk Bi0.5Sb1.5Te3 nanocomposites with homogeneously dispersed metal nanoparticles were fabricated using a spark plasma sintering technique. The lattice thermal conductivities were reduced by increasing the long-wavelength phonon scattering in the presence of metal nanoparticles, while the Seebeck coefficients increased for a few selected metal-decorated nanocomposites, possibly due to the carrier-energy-filtering effect. Finally, the figure of merit ZT was enhanced to 1.4 near room temperature. This approach highlights the feasibility of incorporating various types of nanoparticles into an alloy matrix starting by wet chemical routes, which is an effective means of improving the thermoelectric performance of Bi-Te-based alloys.

Original languageEnglish
Pages (from-to)1411-1416
Number of pages6
JournalJournal of Electronic Materials
Volume42
Issue number7
DOIs
Publication statusPublished - 2013 Jul 1

Fingerprint

Metal nanoparticles
Nanocomposites
nanocomposites
Phonon scattering
Metals
Powders
nanoparticles
Thermal conductivity
metals
Spark plasma sintering
Seebeck coefficient
figure of merit
acetates
thermal conductivity
Acetates
thermoelectric materials
Nanoparticles
metal particles
Wavelength
Seebeck effect

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Hwang, Sungwoo ; Kim, Sang Il ; Ahn, Kyunghan ; Roh, Jong Wook ; Yang, Dae Jin ; Lee, Sang Mock ; Lee, Kyu Hyoung. / Enhancing the thermoelectric properties of p-type bulk Bi-Sb-Te nanocomposites via solution-based metal nanoparticle decoration. In: Journal of Electronic Materials. 2013 ; Vol. 42, No. 7. pp. 1411-1416.
@article{caa9a69d62a24595b0b93b0e73050b45,
title = "Enhancing the thermoelectric properties of p-type bulk Bi-Sb-Te nanocomposites via solution-based metal nanoparticle decoration",
abstract = "Embedding nanosized particles in bulk thermoelectric materials is expected to lower the lattice thermal conductivity by enhancing the degree of interface phonon scattering, thus improving their thermoelectric figure of merit ZT. We have developed a wet chemical process to fabricate Bi0.5Sb 1.5Te3-based thermoelectric nanocomposites which include nanometer-sized metal particles. By simple solution mixing of metal acetate precursors and Bi0.5Sb1.5Te3 powders in ethyl acetate as a medium for homogeneous incorporation, it is possible to apply various types of metal nanoparticles onto the surfaces of the thermoelectric powders. Next, bulk Bi0.5Sb1.5Te3 nanocomposites with homogeneously dispersed metal nanoparticles were fabricated using a spark plasma sintering technique. The lattice thermal conductivities were reduced by increasing the long-wavelength phonon scattering in the presence of metal nanoparticles, while the Seebeck coefficients increased for a few selected metal-decorated nanocomposites, possibly due to the carrier-energy-filtering effect. Finally, the figure of merit ZT was enhanced to 1.4 near room temperature. This approach highlights the feasibility of incorporating various types of nanoparticles into an alloy matrix starting by wet chemical routes, which is an effective means of improving the thermoelectric performance of Bi-Te-based alloys.",
author = "Sungwoo Hwang and Kim, {Sang Il} and Kyunghan Ahn and Roh, {Jong Wook} and Yang, {Dae Jin} and Lee, {Sang Mock} and Lee, {Kyu Hyoung}",
year = "2013",
month = "7",
day = "1",
doi = "10.1007/s11664-012-2280-6",
language = "English",
volume = "42",
pages = "1411--1416",
journal = "Journal of Electronic Materials",
issn = "0361-5235",
publisher = "Springer New York",
number = "7",

}

Enhancing the thermoelectric properties of p-type bulk Bi-Sb-Te nanocomposites via solution-based metal nanoparticle decoration. / Hwang, Sungwoo; Kim, Sang Il; Ahn, Kyunghan; Roh, Jong Wook; Yang, Dae Jin; Lee, Sang Mock; Lee, Kyu Hyoung.

In: Journal of Electronic Materials, Vol. 42, No. 7, 01.07.2013, p. 1411-1416.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Enhancing the thermoelectric properties of p-type bulk Bi-Sb-Te nanocomposites via solution-based metal nanoparticle decoration

AU - Hwang, Sungwoo

AU - Kim, Sang Il

AU - Ahn, Kyunghan

AU - Roh, Jong Wook

AU - Yang, Dae Jin

AU - Lee, Sang Mock

AU - Lee, Kyu Hyoung

PY - 2013/7/1

Y1 - 2013/7/1

N2 - Embedding nanosized particles in bulk thermoelectric materials is expected to lower the lattice thermal conductivity by enhancing the degree of interface phonon scattering, thus improving their thermoelectric figure of merit ZT. We have developed a wet chemical process to fabricate Bi0.5Sb 1.5Te3-based thermoelectric nanocomposites which include nanometer-sized metal particles. By simple solution mixing of metal acetate precursors and Bi0.5Sb1.5Te3 powders in ethyl acetate as a medium for homogeneous incorporation, it is possible to apply various types of metal nanoparticles onto the surfaces of the thermoelectric powders. Next, bulk Bi0.5Sb1.5Te3 nanocomposites with homogeneously dispersed metal nanoparticles were fabricated using a spark plasma sintering technique. The lattice thermal conductivities were reduced by increasing the long-wavelength phonon scattering in the presence of metal nanoparticles, while the Seebeck coefficients increased for a few selected metal-decorated nanocomposites, possibly due to the carrier-energy-filtering effect. Finally, the figure of merit ZT was enhanced to 1.4 near room temperature. This approach highlights the feasibility of incorporating various types of nanoparticles into an alloy matrix starting by wet chemical routes, which is an effective means of improving the thermoelectric performance of Bi-Te-based alloys.

AB - Embedding nanosized particles in bulk thermoelectric materials is expected to lower the lattice thermal conductivity by enhancing the degree of interface phonon scattering, thus improving their thermoelectric figure of merit ZT. We have developed a wet chemical process to fabricate Bi0.5Sb 1.5Te3-based thermoelectric nanocomposites which include nanometer-sized metal particles. By simple solution mixing of metal acetate precursors and Bi0.5Sb1.5Te3 powders in ethyl acetate as a medium for homogeneous incorporation, it is possible to apply various types of metal nanoparticles onto the surfaces of the thermoelectric powders. Next, bulk Bi0.5Sb1.5Te3 nanocomposites with homogeneously dispersed metal nanoparticles were fabricated using a spark plasma sintering technique. The lattice thermal conductivities were reduced by increasing the long-wavelength phonon scattering in the presence of metal nanoparticles, while the Seebeck coefficients increased for a few selected metal-decorated nanocomposites, possibly due to the carrier-energy-filtering effect. Finally, the figure of merit ZT was enhanced to 1.4 near room temperature. This approach highlights the feasibility of incorporating various types of nanoparticles into an alloy matrix starting by wet chemical routes, which is an effective means of improving the thermoelectric performance of Bi-Te-based alloys.

UR - http://www.scopus.com/inward/record.url?scp=84879797464&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84879797464&partnerID=8YFLogxK

U2 - 10.1007/s11664-012-2280-6

DO - 10.1007/s11664-012-2280-6

M3 - Article

AN - SCOPUS:84879797464

VL - 42

SP - 1411

EP - 1416

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 7

ER -