Epitaxial-Growth-Induced Junction Welding of Silver Nanowire Network Electrodes

Hyungseok Kang, Sol Ji Song, Young Eun Sul, Byeong Seon An, Zhenxing Yin, Yongsuk Choi, Lyongsun Pu, Cheol Woong Yang, Youn Sang Kim, Sung Min Cho, Jung Gu Kim, Jeong Ho Cho

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

In this study, we developed a roll-to-roll Ag electroplating process for metallic nanowire electrodes using a galvanostatic mode. Electroplating is a low-cost and facile method for deposition of metal onto a target surface with precise control of both the composition and the thickness. Metallic nanowire networks [silver nanowires (AgNWs) and copper nanowires (CuNWs)] coated onto a polyethylene terephthalate (PET) film were immersed directly in an electroplating bath containing AgNO3. Solvated silver ions (Ag+ ions) were deposited onto the nanowire surface through application of a constant current via an external circuit between the nanowire networks (cathode) and a Ag plate (anode). The amount of electroplated Ag was systematically controlled by changing both the applied current density and the electroplating time, which enabled precise control of the sheet resistance and optical transmittance of the metallic nanowire networks. The optimized Ag-electroplated AgNW (Ag-AgNW) films exhibited a sheet resistance of ?19 ?/sq at an optical transmittance of 90% (550 nm). A transmission electron microscopy study confirmed that Ag grew epitaxially on the AgNW surface, but a polycrystalline Ag structure was formed on the CuNW surface. The Ag-electroplated metallic nanowire electrodes were successfully applied to various electronic devices such as organic light-emitting diodes, triboelectric nanogenerators, and a resistive touch panel. The proposed roll-to-roll Ag electroplating process provides a simple, low-cost, and scalable method for the fabrication of enhanced transparent conductive electrode materials for next-generation electronic devices.

Original languageEnglish
Pages (from-to)4894-4902
Number of pages9
JournalACS Nano
Volume12
Issue number5
DOIs
Publication statusPublished - 2018 May 22

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welding
Silver
Epitaxial growth
Nanowires
Welding
nanowires
silver
electroplating
Electroplating
Electrodes
electrodes
Sheet resistance
Opacity
transmittance
Ions
Polyethylene Terephthalates
touch
polyethylene terephthalate
Organic light emitting diodes (OLED)
electrode materials

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Kang, Hyungseok ; Song, Sol Ji ; Sul, Young Eun ; An, Byeong Seon ; Yin, Zhenxing ; Choi, Yongsuk ; Pu, Lyongsun ; Yang, Cheol Woong ; Kim, Youn Sang ; Cho, Sung Min ; Kim, Jung Gu ; Cho, Jeong Ho. / Epitaxial-Growth-Induced Junction Welding of Silver Nanowire Network Electrodes. In: ACS Nano. 2018 ; Vol. 12, No. 5. pp. 4894-4902.
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abstract = "In this study, we developed a roll-to-roll Ag electroplating process for metallic nanowire electrodes using a galvanostatic mode. Electroplating is a low-cost and facile method for deposition of metal onto a target surface with precise control of both the composition and the thickness. Metallic nanowire networks [silver nanowires (AgNWs) and copper nanowires (CuNWs)] coated onto a polyethylene terephthalate (PET) film were immersed directly in an electroplating bath containing AgNO3. Solvated silver ions (Ag+ ions) were deposited onto the nanowire surface through application of a constant current via an external circuit between the nanowire networks (cathode) and a Ag plate (anode). The amount of electroplated Ag was systematically controlled by changing both the applied current density and the electroplating time, which enabled precise control of the sheet resistance and optical transmittance of the metallic nanowire networks. The optimized Ag-electroplated AgNW (Ag-AgNW) films exhibited a sheet resistance of ?19 ?/sq at an optical transmittance of 90{\%} (550 nm). A transmission electron microscopy study confirmed that Ag grew epitaxially on the AgNW surface, but a polycrystalline Ag structure was formed on the CuNW surface. The Ag-electroplated metallic nanowire electrodes were successfully applied to various electronic devices such as organic light-emitting diodes, triboelectric nanogenerators, and a resistive touch panel. The proposed roll-to-roll Ag electroplating process provides a simple, low-cost, and scalable method for the fabrication of enhanced transparent conductive electrode materials for next-generation electronic devices.",
author = "Hyungseok Kang and Song, {Sol Ji} and Sul, {Young Eun} and An, {Byeong Seon} and Zhenxing Yin and Yongsuk Choi and Lyongsun Pu and Yang, {Cheol Woong} and Kim, {Youn Sang} and Cho, {Sung Min} and Kim, {Jung Gu} and Cho, {Jeong Ho}",
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Kang, H, Song, SJ, Sul, YE, An, BS, Yin, Z, Choi, Y, Pu, L, Yang, CW, Kim, YS, Cho, SM, Kim, JG & Cho, JH 2018, 'Epitaxial-Growth-Induced Junction Welding of Silver Nanowire Network Electrodes', ACS Nano, vol. 12, no. 5, pp. 4894-4902. https://doi.org/10.1021/acsnano.8b01900

Epitaxial-Growth-Induced Junction Welding of Silver Nanowire Network Electrodes. / Kang, Hyungseok; Song, Sol Ji; Sul, Young Eun; An, Byeong Seon; Yin, Zhenxing; Choi, Yongsuk; Pu, Lyongsun; Yang, Cheol Woong; Kim, Youn Sang; Cho, Sung Min; Kim, Jung Gu; Cho, Jeong Ho.

In: ACS Nano, Vol. 12, No. 5, 22.05.2018, p. 4894-4902.

Research output: Contribution to journalArticle

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T1 - Epitaxial-Growth-Induced Junction Welding of Silver Nanowire Network Electrodes

AU - Kang, Hyungseok

AU - Song, Sol Ji

AU - Sul, Young Eun

AU - An, Byeong Seon

AU - Yin, Zhenxing

AU - Choi, Yongsuk

AU - Pu, Lyongsun

AU - Yang, Cheol Woong

AU - Kim, Youn Sang

AU - Cho, Sung Min

AU - Kim, Jung Gu

AU - Cho, Jeong Ho

PY - 2018/5/22

Y1 - 2018/5/22

N2 - In this study, we developed a roll-to-roll Ag electroplating process for metallic nanowire electrodes using a galvanostatic mode. Electroplating is a low-cost and facile method for deposition of metal onto a target surface with precise control of both the composition and the thickness. Metallic nanowire networks [silver nanowires (AgNWs) and copper nanowires (CuNWs)] coated onto a polyethylene terephthalate (PET) film were immersed directly in an electroplating bath containing AgNO3. Solvated silver ions (Ag+ ions) were deposited onto the nanowire surface through application of a constant current via an external circuit between the nanowire networks (cathode) and a Ag plate (anode). The amount of electroplated Ag was systematically controlled by changing both the applied current density and the electroplating time, which enabled precise control of the sheet resistance and optical transmittance of the metallic nanowire networks. The optimized Ag-electroplated AgNW (Ag-AgNW) films exhibited a sheet resistance of ?19 ?/sq at an optical transmittance of 90% (550 nm). A transmission electron microscopy study confirmed that Ag grew epitaxially on the AgNW surface, but a polycrystalline Ag structure was formed on the CuNW surface. The Ag-electroplated metallic nanowire electrodes were successfully applied to various electronic devices such as organic light-emitting diodes, triboelectric nanogenerators, and a resistive touch panel. The proposed roll-to-roll Ag electroplating process provides a simple, low-cost, and scalable method for the fabrication of enhanced transparent conductive electrode materials for next-generation electronic devices.

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Kang H, Song SJ, Sul YE, An BS, Yin Z, Choi Y et al. Epitaxial-Growth-Induced Junction Welding of Silver Nanowire Network Electrodes. ACS Nano. 2018 May 22;12(5):4894-4902. https://doi.org/10.1021/acsnano.8b01900