TY - JOUR
T1 - Evaluating the heat transfer phenomena and the interfacial thermal resistance of mold flux using a copper disc mold simulator
AU - Park, Jun Yong
AU - Sohn, Il
N1 - Publisher Copyright:
© 2017 Elsevier Ltd
Copyright:
Copyright 2018 Elsevier B.V., All rights reserved.
PY - 2017
Y1 - 2017
N2 - The new modified pouring method (copper disc mold simulator, CDMS) to investigate the interfacial thermal resistance and crystallinity for the mold fluxes was introduced. To make sure the formation of the air gap, the surface waviness was measured with the crystallinity. The interfacial thermal resistance increased with higher average waviness, which means the average height of air gap. However, the average waviness did not increase with the higher crystallinity. This result came from the different crystallization mechanisms and the contraction of the flux during the solidification and crystallization was varied based on the crystallization mechanism. Therefore, it is important to apply the mold flux which has optimum crystallization behavior because applying the strong crystallized mold flux to increase the interfacial thermal resistance does not always bring the high interfacial thermal resistance.
AB - The new modified pouring method (copper disc mold simulator, CDMS) to investigate the interfacial thermal resistance and crystallinity for the mold fluxes was introduced. To make sure the formation of the air gap, the surface waviness was measured with the crystallinity. The interfacial thermal resistance increased with higher average waviness, which means the average height of air gap. However, the average waviness did not increase with the higher crystallinity. This result came from the different crystallization mechanisms and the contraction of the flux during the solidification and crystallization was varied based on the crystallization mechanism. Therefore, it is important to apply the mold flux which has optimum crystallization behavior because applying the strong crystallized mold flux to increase the interfacial thermal resistance does not always bring the high interfacial thermal resistance.
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U2 - 10.1016/j.ijheatmasstransfer.2017.02.092
DO - 10.1016/j.ijheatmasstransfer.2017.02.092
M3 - Article
AN - SCOPUS:85014487101
VL - 109
SP - 1014
EP - 1025
JO - International Journal of Heat and Mass Transfer
JF - International Journal of Heat and Mass Transfer
SN - 0017-9310
ER -