Evaluation of ground inductance in printed circuit boards

J. G. Yook, M. Kurk, N. I. Dib, L. P.B. Katehi, T. R. Arabi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The problem of a printed circuit board (PCB) via is analyzed through the scattering parameter and the flux methods. The two results are compared in an effort to establish the relationship between the two techniques and evaluate their contributions. A ground via in a one-port and two-port configuration is studied in the time and frequency domains using the finite difference time domain (FDTD) and the finite element method (FEM) respectively. The scattering parameters for the via configuration are computed and compared for validation purposes.

Original languageEnglish
Title of host publicationIEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages119-121
Number of pages3
ISBN (Electronic)0780314271, 9780780314276
DOIs
Publication statusPublished - 1993 Jan 1
Event2nd IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993 - Monterey, United States
Duration: 1993 Oct 201993 Oct 22

Publication series

NameIEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993

Conference

Conference2nd IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993
CountryUnited States
CityMonterey
Period93/10/2093/10/22

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Yook, J. G., Kurk, M., Dib, N. I., Katehi, L. P. B., & Arabi, T. R. (1993). Evaluation of ground inductance in printed circuit boards. In IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993 (pp. 119-121). [394575] (IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.1993.394575