Evaluation of ground inductance in printed circuit boards

J. G. Yook; M. Kurk; N. I. Dib; L. P.B. Katehi; T. R. Arabi

doi:10.1109/EPEP.1993.394575

Evaluation of ground inductance in printed circuit boards

J. G. Yook, M. Kurk, N. I. Dib, L. P.B. Katehi, T. R. Arabi

Department of Electrical and Electronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

The problem of a printed circuit board (PCB) via is analyzed through the scattering parameter and the flux methods. The two results are compared in an effort to establish the relationship between the two techniques and evaluate their contributions. A ground via in a one-port and two-port configuration is studied in the time and frequency domains using the finite difference time domain (FDTD) and the finite element method (FEM) respectively. The scattering parameters for the via configuration are computed and compared for validation purposes.

Original language	English
Title of host publication	IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	119-121
Number of pages	3
ISBN (Electronic)	0780314271, 9780780314276
DOIs	https://doi.org/10.1109/EPEP.1993.394575
Publication status	Published - 1993
Event	2nd IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993 - Monterey, United States Duration: 1993 Oct 20 → 1993 Oct 22

Publication series

Name	IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993

Conference

Conference	2nd IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993
Country/Territory	United States
City	Monterey
Period	93/10/20 → 93/10/22

Bibliographical note

Funding Information:
Acknowlcdgmen ts This work 11a bwn supponcd by a11 award from INTEL Co. Rcrercnces 1. T. Wang. R.F.Harrington and J.R. Mauu., "Thc Equivalent Circuit of a Via," Trans. Soc. Compuler Simu- lations, Vo1.4, pp.97-123. 2. A. R. Djordjevic and T. K. Sarkar. "Umpumtion of Inductance of Simple Vias Hctwwri Two Suiplines Above a Ground Plane," lEEE Trans. of Microwave Theory tind Tcctiniqws, Vd 33. No. 3. PP. 265-26'3. 3. P. H. Harms, J-F k c and K. MiLtrd, "Characterizing the Cylindric.al Via Discontinuity." IEEE Trans. on Microwave Thtory and 'Rchniqws, V01.4 I, No.I , pp, i S.7- 156. P. .---.--__ . .. . . . . . kvdruUm olCIround 1nduclnnc;c in h n k J Clrtnbl h r s h

Publisher Copyright:
© 1993 IEEE.

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/EPEP.1993.394575

Cite this

Yook, J. G., Kurk, M., Dib, N. I., Katehi, L. P. B., & Arabi, T. R. (1993). Evaluation of ground inductance in printed circuit boards. In IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993 (pp. 119-121). [394575] (IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.1993.394575

@inproceedings{a6a9e3fdcd624940a5fb58760608af5f,

title = "Evaluation of ground inductance in printed circuit boards",

abstract = "The problem of a printed circuit board (PCB) via is analyzed through the scattering parameter and the flux methods. The two results are compared in an effort to establish the relationship between the two techniques and evaluate their contributions. A ground via in a one-port and two-port configuration is studied in the time and frequency domains using the finite difference time domain (FDTD) and the finite element method (FEM) respectively. The scattering parameters for the via configuration are computed and compared for validation purposes.",

author = "Yook, {J. G.} and M. Kurk and Dib, {N. I.} and Katehi, {L. P.B.} and Arabi, {T. R.}",

note = "Funding Information: Acknowlcdgmen ts This work 11a bwn supponcd by a11 award from INTEL Co. Rcrercnces 1. T. Wang. R.F.Harrington and J.R. Mauu., {"}Thc Equivalent Circuit of a Via,{"} Trans. Soc. Compuler Simu- lations, Vo1.4, pp.97-123. 2. A. R. Djordjevic and T. K. Sarkar. {"}Umpumtion of Inductance of Simple Vias Hctwwri Two Suiplines Above a Ground Plane,{"} lEEE Trans. of Microwave Theory tind Tcctiniqws, Vd 33. No. 3. PP. 265-26'3. 3. P. H. Harms, J-F k c and K. MiLtrd, {"}Characterizing the Cylindric.al Via Discontinuity.{"} IEEE Trans. on Microwave Thtory and 'Rchniqws, V01.4 I, No.I , pp, i S.7- 156. P. .---.--__ . .. . . . . . kvdruUm olCIround 1nduclnnc;c in h n k J Clrtnbl h r s h Publisher Copyright: {\textcopyright} 1993 IEEE.; 2nd IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993 ; Conference date: 20-10-1993 Through 22-10-1993",

year = "1993",

doi = "10.1109/EPEP.1993.394575",

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address = "United States",

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Yook, JG, Kurk, M, Dib, NI, Katehi, LPB & Arabi, TR 1993, Evaluation of ground inductance in printed circuit boards. in IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993., 394575, IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993, Institute of Electrical and Electronics Engineers Inc., pp. 119-121, 2nd IEEE Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993, Monterey, United States, 93/10/20. https://doi.org/10.1109/EPEP.1993.394575

Evaluation of ground inductance in printed circuit boards. / Yook, J. G.; Kurk, M.; Dib, N. I. et al.

IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993. Institute of Electrical and Electronics Engineers Inc., 1993. p. 119-121 394575 (IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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N1 - Funding Information: Acknowlcdgmen ts This work 11a bwn supponcd by a11 award from INTEL Co. Rcrercnces 1. T. Wang. R.F.Harrington and J.R. Mauu., "Thc Equivalent Circuit of a Via," Trans. Soc. Compuler Simu- lations, Vo1.4, pp.97-123. 2. A. R. Djordjevic and T. K. Sarkar. "Umpumtion of Inductance of Simple Vias Hctwwri Two Suiplines Above a Ground Plane," lEEE Trans. of Microwave Theory tind Tcctiniqws, Vd 33. No. 3. PP. 265-26'3. 3. P. H. Harms, J-F k c and K. MiLtrd, "Characterizing the Cylindric.al Via Discontinuity." IEEE Trans. on Microwave Thtory and 'Rchniqws, V01.4 I, No.I , pp, i S.7- 156. P. .---.--__ . .. . . . . . kvdruUm olCIround 1nduclnnc;c in h n k J Clrtnbl h r s h Publisher Copyright: © 1993 IEEE.

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N2 - The problem of a printed circuit board (PCB) via is analyzed through the scattering parameter and the flux methods. The two results are compared in an effort to establish the relationship between the two techniques and evaluate their contributions. A ground via in a one-port and two-port configuration is studied in the time and frequency domains using the finite difference time domain (FDTD) and the finite element method (FEM) respectively. The scattering parameters for the via configuration are computed and compared for validation purposes.

AB - The problem of a printed circuit board (PCB) via is analyzed through the scattering parameter and the flux methods. The two results are compared in an effort to establish the relationship between the two techniques and evaluate their contributions. A ground via in a one-port and two-port configuration is studied in the time and frequency domains using the finite difference time domain (FDTD) and the finite element method (FEM) respectively. The scattering parameters for the via configuration are computed and compared for validation purposes.

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Yook JG, Kurk M, Dib NI, Katehi LPB, Arabi TR. Evaluation of ground inductance in printed circuit boards. In IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993. Institute of Electrical and Electronics Engineers Inc. 1993. p. 119-121. 394575. (IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993). doi: 10.1109/EPEP.1993.394575

Evaluation of ground inductance in printed circuit boards

Abstract

Publication series

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Bibliographical note

All Science Journal Classification (ASJC) codes

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