Evolution of microstructure and surface bonding in SiO2 aerogel film after plasma treatment using O2, N2, and H2 gases

Jean Jong Kim, Hyung Ho Park, Sang Hoon Hyun

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)


In this work, we investigated the effects of various gases (O2, N2, and H2) plasma treatment on SiO2 aerogel films in order to strengthen the film and improve the surface chemical bonding nature of the film. The plasma treatments could reduce the density of silanol (Si-OH) and ethoxy (Si-OR) groups. The physical, chemical, and electrical properties of SiO2 aerogel film through curing with various plasma gases were evaluated. The modification of SiO2 aerogel film by plasma gas treatment was related to the physical impingement effect of ions, chemical reaction, and irradiated vacuum UV.

Original languageEnglish
Pages (from-to)236-242
Number of pages7
JournalThin Solid Films
Issue number2
Publication statusPublished - 2001 Mar 15

Bibliographical note

Funding Information:
The authors of this paper would like to thank the Samsung Electronics Corporation for its support of this research and Brain Korea 21 project.

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry


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