Evolution of microstructure and surface bonding in SiO2 aerogel film after plasma treatment using O2, N2, and H2 gases

Jean Jong Kim; Hyung Ho Park; Sang Hoon Hyun

doi:10.1016/S0040-6090(00)01827-7

Evolution of microstructure and surface bonding in SiO₂ aerogel film after plasma treatment using O₂, N₂, and H₂ gases

Jean Jong Kim, Hyung Ho Park, Sang Hoon Hyun

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

16 Citations (Scopus)

Abstract

In this work, we investigated the effects of various gases (O₂, N₂, and H₂) plasma treatment on SiO₂ aerogel films in order to strengthen the film and improve the surface chemical bonding nature of the film. The plasma treatments could reduce the density of silanol (Si-OH) and ethoxy (Si-OR) groups. The physical, chemical, and electrical properties of SiO₂ aerogel film through curing with various plasma gases were evaluated. The modification of SiO₂ aerogel film by plasma gas treatment was related to the physical impingement effect of ions, chemical reaction, and irradiated vacuum UV.

Original language	English
Pages (from-to)	236-242
Number of pages	7
Journal	Thin Solid Films
Volume	384
Issue number	2
DOIs	https://doi.org/10.1016/S0040-6090(00)01827-7
Publication status	Published - 2001 Mar 15

Bibliographical note

Funding Information:
The authors of this paper would like to thank the Samsung Electronics Corporation for its support of this research and Brain Korea 21 project.

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Metals and Alloys
Materials Chemistry

Access to Document

10.1016/S0040-6090(00)01827-7

Cite this

@article{756646d50cc847c8bcbd6fd53835fa6e,

title = "Evolution of microstructure and surface bonding in SiO2 aerogel film after plasma treatment using O2, N2, and H2 gases",

abstract = "In this work, we investigated the effects of various gases (O2, N2, and H2) plasma treatment on SiO2 aerogel films in order to strengthen the film and improve the surface chemical bonding nature of the film. The plasma treatments could reduce the density of silanol (Si-OH) and ethoxy (Si-OR) groups. The physical, chemical, and electrical properties of SiO2 aerogel film through curing with various plasma gases were evaluated. The modification of SiO2 aerogel film by plasma gas treatment was related to the physical impingement effect of ions, chemical reaction, and irradiated vacuum UV.",

author = "Kim, {Jean Jong} and Park, {Hyung Ho} and Hyun, {Sang Hoon}",

note = "Funding Information: The authors of this paper would like to thank the Samsung Electronics Corporation for its support of this research and Brain Korea 21 project.",

year = "2001",

month = mar,

day = "15",

doi = "10.1016/S0040-6090(00)01827-7",

language = "English",

volume = "384",

pages = "236--242",

journal = "Thin Solid Films",

issn = "0040-6090",

publisher = "Elsevier",

number = "2",

}

TY - JOUR

T1 - Evolution of microstructure and surface bonding in SiO2 aerogel film after plasma treatment using O2, N2, and H2 gases

AU - Kim, Jean Jong

AU - Park, Hyung Ho

AU - Hyun, Sang Hoon

N1 - Funding Information: The authors of this paper would like to thank the Samsung Electronics Corporation for its support of this research and Brain Korea 21 project.

PY - 2001/3/15

Y1 - 2001/3/15

N2 - In this work, we investigated the effects of various gases (O2, N2, and H2) plasma treatment on SiO2 aerogel films in order to strengthen the film and improve the surface chemical bonding nature of the film. The plasma treatments could reduce the density of silanol (Si-OH) and ethoxy (Si-OR) groups. The physical, chemical, and electrical properties of SiO2 aerogel film through curing with various plasma gases were evaluated. The modification of SiO2 aerogel film by plasma gas treatment was related to the physical impingement effect of ions, chemical reaction, and irradiated vacuum UV.

AB - In this work, we investigated the effects of various gases (O2, N2, and H2) plasma treatment on SiO2 aerogel films in order to strengthen the film and improve the surface chemical bonding nature of the film. The plasma treatments could reduce the density of silanol (Si-OH) and ethoxy (Si-OR) groups. The physical, chemical, and electrical properties of SiO2 aerogel film through curing with various plasma gases were evaluated. The modification of SiO2 aerogel film by plasma gas treatment was related to the physical impingement effect of ions, chemical reaction, and irradiated vacuum UV.

UR - http://www.scopus.com/inward/record.url?scp=0034836136&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0034836136&partnerID=8YFLogxK

U2 - 10.1016/S0040-6090(00)01827-7

DO - 10.1016/S0040-6090(00)01827-7

M3 - Article

AN - SCOPUS:0034836136

SN - 0040-6090

VL - 384

SP - 236

EP - 242

JO - Thin Solid Films

JF - Thin Solid Films

IS - 2

ER -