Experimental verification of the use of metal filled via hole fences for crosstalk control of microstrip lines in LTCC packages

George E. Ponchak, Donghoon Chun, Jong Gwan Yook, Linda P.B. Katehi

Research output: Contribution to journalArticle

27 Citations (Scopus)

Abstract

Coupling between microstrip lines in dense RF packages is a common problem that degrades circuit performance. Prior three-dimensional-finite element method (3-D-FEM) electromagnetic simulations have shown that metal filled via hole fences between two adjacent microstrip lines actually increases coupling between the lines; however, if the top of the via posts are connected by a metal strip, coupling is reduced. In this paper, experimental verification of the 3-D-FEM simulations is demonstrated for commercially fabricated low temperature cofired ceramic (LTCC) packages. In addition, measured attenuation of microstrip lines surrounded by the shielding structures is presented and shows that shielding structures do not change the attenuation characteristics of the line.

Original languageEnglish
Pages (from-to)76-80
Number of pages5
JournalIEEE Transactions on Advanced Packaging
Volume24
Issue number1
DOIs
Publication statusPublished - 2001 Feb 1

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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