TY - JOUR
T1 - Fabrication and characterization of hollow metal waveguides for optical interconnect applications
AU - Bicknell, Robert
AU - King, Laura
AU - Otis, Charles E.
AU - Yeo, Jong Souk
AU - Meyer, Neal
AU - Kornilovitch, Pavel
AU - Lerner, Scott
AU - Seals, Lenward
PY - 2009/6
Y1 - 2009/6
N2 - As data rates continue to increase in high-performance computer systems and networks, it is becoming more difficult for copper-based interconnects to keep pace. An alternative approach to meet these requirements is to move to optical-based interconnect technologies which offer a number of advantages over the legacy copper-based solutions. In order to meet the stringent requirements of high performance and low cost, manufacturable waveguide technologies must be developed. Past solutions have often employed polymer waveguide technologies, which can be expensive and limited by modal dispersion. In the present work, hollow metal waveguides (HMWGs) are investigated as a potential alternative. These waveguides demonstrate very low optical losses of <0.05 dB/cm and the capability to transmit at extremely high data rates. The fabrication, modeling, characterization of the HMWGs are discussed to enable photonic interconnect solutions for future generations of computer and server products.
AB - As data rates continue to increase in high-performance computer systems and networks, it is becoming more difficult for copper-based interconnects to keep pace. An alternative approach to meet these requirements is to move to optical-based interconnect technologies which offer a number of advantages over the legacy copper-based solutions. In order to meet the stringent requirements of high performance and low cost, manufacturable waveguide technologies must be developed. Past solutions have often employed polymer waveguide technologies, which can be expensive and limited by modal dispersion. In the present work, hollow metal waveguides (HMWGs) are investigated as a potential alternative. These waveguides demonstrate very low optical losses of <0.05 dB/cm and the capability to transmit at extremely high data rates. The fabrication, modeling, characterization of the HMWGs are discussed to enable photonic interconnect solutions for future generations of computer and server products.
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U2 - 10.1007/s00339-009-5206-2
DO - 10.1007/s00339-009-5206-2
M3 - Article
AN - SCOPUS:67649090218
SN - 0947-8396
VL - 95
SP - 1059
EP - 1066
JO - Applied Physics A: Materials Science and Processing
JF - Applied Physics A: Materials Science and Processing
IS - 4
ER -