TY - GEN
T1 - Fabrication and electrical transport properties of CVD grown silicon carbide nanowires (SiC NWs) for field effect transistor
AU - Seong, Han Kyu
AU - Lee, Seung Yong
AU - Choi, Heon Jin
AU - Kim, Tae Hong
AU - Cho, Nam Kyu
AU - Nahm, Kee Suk
AU - Lee, Sang Kwon
PY - 2006
Y1 - 2006
N2 - We demonstrate the fabrication and the electrical transport properties of single crystalline 3C silicon carbide nanowires (SiC NWs). The growth of SiC NWs was carried out in a chemical vapor deposition (CVD) furnace. Methyltrichlorosilane (MTS, CH3SiCl3) was chosen as a source precursor. SiC NWs had diameters of less than 100 nm and lengths of several μm. For electrical transport measurements, as-gown SiC NWs were prepared on a highly doped silicon wafer, pre-patterned by a photo-lithography process, with a 400 nm thick SiO2 layer. Source and drain electrodes were defined by e-beam lithography (EBL). Prior to the metal deposition (Ti/Au : 40 nm/70 nm) by thermal evaporation, the native oxide on SiC NWs was removed by buffered HF. The estimated mobility of carriers is 15 cm2/(Vs) for a source-drain voltage (VSD) of 0.02 V. It is very low compared to that expected in bulk and/or thin film 3C-SiC The electrical measurements from nanowire-based field effect transistor (FET) structures illustrate that SiC NWs are weak n-type semiconductor. We have also demonstrated a powerful technique, a standard UV photo-lithography process, for fabrication of SiC nanowires instead of using EBL process.
AB - We demonstrate the fabrication and the electrical transport properties of single crystalline 3C silicon carbide nanowires (SiC NWs). The growth of SiC NWs was carried out in a chemical vapor deposition (CVD) furnace. Methyltrichlorosilane (MTS, CH3SiCl3) was chosen as a source precursor. SiC NWs had diameters of less than 100 nm and lengths of several μm. For electrical transport measurements, as-gown SiC NWs were prepared on a highly doped silicon wafer, pre-patterned by a photo-lithography process, with a 400 nm thick SiO2 layer. Source and drain electrodes were defined by e-beam lithography (EBL). Prior to the metal deposition (Ti/Au : 40 nm/70 nm) by thermal evaporation, the native oxide on SiC NWs was removed by buffered HF. The estimated mobility of carriers is 15 cm2/(Vs) for a source-drain voltage (VSD) of 0.02 V. It is very low compared to that expected in bulk and/or thin film 3C-SiC The electrical measurements from nanowire-based field effect transistor (FET) structures illustrate that SiC NWs are weak n-type semiconductor. We have also demonstrated a powerful technique, a standard UV photo-lithography process, for fabrication of SiC nanowires instead of using EBL process.
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U2 - 10.4028/0-87849-425-1.771
DO - 10.4028/0-87849-425-1.771
M3 - Conference contribution
AN - SCOPUS:35748972135
SN - 9780878494255
T3 - Materials Science Forum
SP - 771
EP - 774
BT - Silicon Carbide and Related Materials 2005, - Proceedings of the International Conference on Silicon Carbide and Related Materials 2005
PB - Trans Tech Publications Ltd
T2 - International Conference on Silicon Carbide and Related Materials 2005, (ICSCRM 2005)
Y2 - 18 September 2005 through 23 September 2005
ER -