Fabrication and thermal analysis of wafer-level light-emitting diode packages

Jeung Mo Kang, Jeong Hyeon Choi, Du Hyun Kim, Jae Wook Kim, Yong Seon Song, Geun Ho Kim, Sang Kook Han

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

Wafer-level packaged light-emitting diodes (LEDs) are useful for the high-power applications such as back light unit and general solid-state lighting due to the compactness and integrated fabrication process. In this letter, wafer-level packaged LEDs with red, green, and blue multichips were fabricated, and the thermal characteristics of wafer-level packaged LEDs with multichips such as thermal resistance and junction temperature are investigated using both serial and matrix measurement methods.

Original languageEnglish
Pages (from-to)1118-1120
Number of pages3
JournalIEEE Electron Device Letters
Volume29
Issue number10
DOIs
Publication statusPublished - 2008 Oct 9

Fingerprint

Thermoanalysis
Light emitting diodes
Fabrication
Heat resistance
Lighting
Temperature
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Kang, Jeung Mo ; Choi, Jeong Hyeon ; Kim, Du Hyun ; Kim, Jae Wook ; Song, Yong Seon ; Kim, Geun Ho ; Han, Sang Kook. / Fabrication and thermal analysis of wafer-level light-emitting diode packages. In: IEEE Electron Device Letters. 2008 ; Vol. 29, No. 10. pp. 1118-1120.
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Fabrication and thermal analysis of wafer-level light-emitting diode packages. / Kang, Jeung Mo; Choi, Jeong Hyeon; Kim, Du Hyun; Kim, Jae Wook; Song, Yong Seon; Kim, Geun Ho; Han, Sang Kook.

In: IEEE Electron Device Letters, Vol. 29, No. 10, 09.10.2008, p. 1118-1120.

Research output: Contribution to journalArticle

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