Fabrication of 10 µm-scale conductive Cu patterns by selective laser sintering of Cu complex ink

Hyungsuk Min, Byoungyoon Lee, Sooncheol Jeong, Myeongkyu Lee

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26 Citations (Scopus)


A Cu complex ink was synthesized using copper formate as a precursor and its potential for laser patterning was investigated. The Cu ink was spin-coated onto a substrate and the coated film was space-selectively sintered using a nanosecond-pulsed ultraviolet laser. The unexposed Cu ink could be removed from the film by rinsing it with the dispersing agent used to synthesize the ink, disclosing a conductive Cu pattern. A minimum resistivity of 8.46×10−5 Ω cm was obtained for the Cu lines with 10–20 µm widths. The feasibility of this method for metallization was demonstrated by fabricating a complex Cu electric circuit on an indium tin oxide-coated glass substrate. The selective laser sintering approach provides a simple, cost-effective alternative to conventional lithography for the production of electrode or metallization patterns.

Original languageEnglish
Pages (from-to)128-133
Number of pages6
JournalOptics and Laser Technology
Publication statusPublished - 2017 Feb 1

Bibliographical note

Funding Information:
This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government ( MSIP ) (No. 2015R1A2A1A15053000 ). The authors declare no competing financial interest.

Publisher Copyright:
© 2016 Elsevier Ltd

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering


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