Fabrication of high-aspect-ratio microgrooves using an electrochemical discharge micromilling process

Min Seop Han, Ki Woon Chae, Byung-Kwon Min

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

In this study, we created high-aspect-ratio microgrooves in hard, brittle materials using an electrochemical discharge machining (ECDM) process by introducing microtextured machining tool. To enhance the electrical discharge activity, the morphology of the tool side surface was treated via micro-electrical discharge machining to produce fine microprotrusive patterns. The resulting microtextured surface morphology enhanced the electric field and played a key role in improving the step milling depth in the ECDM process. Using the FEM analysis, the evaluation of the field enhancement factor is also addressed. Our experimental investigation revealed microgrooves having an aspect ratio of 1:4, with high geometric accuracy and crack-free surfaces, using one-step ECDM.

Original languageEnglish
Article number055004
JournalJournal of Micromechanics and Microengineering
Volume27
Issue number5
DOIs
Publication statusPublished - 2017 Mar 23

Fingerprint

Electric discharge machining
Aspect ratio
Fabrication
Milling (machining)
Brittleness
Surface morphology
Machining
Electric fields
Cracks
Finite element method

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

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abstract = "In this study, we created high-aspect-ratio microgrooves in hard, brittle materials using an electrochemical discharge machining (ECDM) process by introducing microtextured machining tool. To enhance the electrical discharge activity, the morphology of the tool side surface was treated via micro-electrical discharge machining to produce fine microprotrusive patterns. The resulting microtextured surface morphology enhanced the electric field and played a key role in improving the step milling depth in the ECDM process. Using the FEM analysis, the evaluation of the field enhancement factor is also addressed. Our experimental investigation revealed microgrooves having an aspect ratio of 1:4, with high geometric accuracy and crack-free surfaces, using one-step ECDM.",
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Fabrication of high-aspect-ratio microgrooves using an electrochemical discharge micromilling process. / Han, Min Seop; Chae, Ki Woon; Min, Byung-Kwon.

In: Journal of Micromechanics and Microengineering, Vol. 27, No. 5, 055004, 23.03.2017.

Research output: Contribution to journalArticle

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