Fabrication of metallic nano stamp to replicate patterned substrate using electron-beam recording, nanoimprinting, and electroforming

Hokwan Kim, Sang Chul Shin, Jungjin Han, Jeongwon Han, Shinill Kang

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

A cost-effective method to fabricate metallic nano stamp with full tracks of nano hole patterns with diameter of 30 nm and pitch of 50 nm was developed for nanoreplicating nano patterned substrate. Electron-beam recording (EBR) and inductively coupled plasma etching process were used in order to fabricate the original silicon master with hole patterns. Polymeric master with full tracks of nano pillar patterns was replicated from the original silicon master by UV nanoimprinting process. For the successful releasing during UV nanoimprinting process, self assembled monolayer of fluoroctatrichlorosilane was deposited on the original silicon master. With this approach, the expensive silicon master could be reused many times as a master mold. Nickel seed layer as conductive layer was deposited onto the polymeric master using sputtering process. Nanoelectroforming process using nickel sulfamate solution was used to fabricate metallic nano stamp. Metallic nano stamp with full tracks of hole patterns having diameter of 30 nm, pitch of 50 nm, track width of 1.3 mm, and track inner diameter of 40 mm was successfully fabricated. The present method will provide an important mean to mass fabricate patterned media.

Original languageEnglish
Article number4816016
Pages (from-to)2304-2307
Number of pages4
JournalIEEE Transactions on Magnetics
Volume45
Issue number5
DOIs
Publication statusPublished - 2009 May 1

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Electroforming
Silicon
Electron beams
Fabrication
Substrates
Nickel
Plasma etching
Inductively coupled plasma
Self assembled monolayers
Sputtering
Seed
Costs

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

@article{786e42ecb00746fb8d5537b34b6f3891,
title = "Fabrication of metallic nano stamp to replicate patterned substrate using electron-beam recording, nanoimprinting, and electroforming",
abstract = "A cost-effective method to fabricate metallic nano stamp with full tracks of nano hole patterns with diameter of 30 nm and pitch of 50 nm was developed for nanoreplicating nano patterned substrate. Electron-beam recording (EBR) and inductively coupled plasma etching process were used in order to fabricate the original silicon master with hole patterns. Polymeric master with full tracks of nano pillar patterns was replicated from the original silicon master by UV nanoimprinting process. For the successful releasing during UV nanoimprinting process, self assembled monolayer of fluoroctatrichlorosilane was deposited on the original silicon master. With this approach, the expensive silicon master could be reused many times as a master mold. Nickel seed layer as conductive layer was deposited onto the polymeric master using sputtering process. Nanoelectroforming process using nickel sulfamate solution was used to fabricate metallic nano stamp. Metallic nano stamp with full tracks of hole patterns having diameter of 30 nm, pitch of 50 nm, track width of 1.3 mm, and track inner diameter of 40 mm was successfully fabricated. The present method will provide an important mean to mass fabricate patterned media.",
author = "Hokwan Kim and Shin, {Sang Chul} and Jungjin Han and Jeongwon Han and Shinill Kang",
year = "2009",
month = "5",
day = "1",
doi = "10.1109/TMAG.2009.2016476",
language = "English",
volume = "45",
pages = "2304--2307",
journal = "IEEE Transactions on Magnetics",
issn = "0018-9464",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "5",

}

Fabrication of metallic nano stamp to replicate patterned substrate using electron-beam recording, nanoimprinting, and electroforming. / Kim, Hokwan; Shin, Sang Chul; Han, Jungjin; Han, Jeongwon; Kang, Shinill.

In: IEEE Transactions on Magnetics, Vol. 45, No. 5, 4816016, 01.05.2009, p. 2304-2307.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Fabrication of metallic nano stamp to replicate patterned substrate using electron-beam recording, nanoimprinting, and electroforming

AU - Kim, Hokwan

AU - Shin, Sang Chul

AU - Han, Jungjin

AU - Han, Jeongwon

AU - Kang, Shinill

PY - 2009/5/1

Y1 - 2009/5/1

N2 - A cost-effective method to fabricate metallic nano stamp with full tracks of nano hole patterns with diameter of 30 nm and pitch of 50 nm was developed for nanoreplicating nano patterned substrate. Electron-beam recording (EBR) and inductively coupled plasma etching process were used in order to fabricate the original silicon master with hole patterns. Polymeric master with full tracks of nano pillar patterns was replicated from the original silicon master by UV nanoimprinting process. For the successful releasing during UV nanoimprinting process, self assembled monolayer of fluoroctatrichlorosilane was deposited on the original silicon master. With this approach, the expensive silicon master could be reused many times as a master mold. Nickel seed layer as conductive layer was deposited onto the polymeric master using sputtering process. Nanoelectroforming process using nickel sulfamate solution was used to fabricate metallic nano stamp. Metallic nano stamp with full tracks of hole patterns having diameter of 30 nm, pitch of 50 nm, track width of 1.3 mm, and track inner diameter of 40 mm was successfully fabricated. The present method will provide an important mean to mass fabricate patterned media.

AB - A cost-effective method to fabricate metallic nano stamp with full tracks of nano hole patterns with diameter of 30 nm and pitch of 50 nm was developed for nanoreplicating nano patterned substrate. Electron-beam recording (EBR) and inductively coupled plasma etching process were used in order to fabricate the original silicon master with hole patterns. Polymeric master with full tracks of nano pillar patterns was replicated from the original silicon master by UV nanoimprinting process. For the successful releasing during UV nanoimprinting process, self assembled monolayer of fluoroctatrichlorosilane was deposited on the original silicon master. With this approach, the expensive silicon master could be reused many times as a master mold. Nickel seed layer as conductive layer was deposited onto the polymeric master using sputtering process. Nanoelectroforming process using nickel sulfamate solution was used to fabricate metallic nano stamp. Metallic nano stamp with full tracks of hole patterns having diameter of 30 nm, pitch of 50 nm, track width of 1.3 mm, and track inner diameter of 40 mm was successfully fabricated. The present method will provide an important mean to mass fabricate patterned media.

UR - http://www.scopus.com/inward/record.url?scp=65349192203&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=65349192203&partnerID=8YFLogxK

U2 - 10.1109/TMAG.2009.2016476

DO - 10.1109/TMAG.2009.2016476

M3 - Article

AN - SCOPUS:65349192203

VL - 45

SP - 2304

EP - 2307

JO - IEEE Transactions on Magnetics

JF - IEEE Transactions on Magnetics

SN - 0018-9464

IS - 5

M1 - 4816016

ER -