Fabrication of nanochannels with high aspect ratios on a silicon substrate by local focused ion beam implantation and deep reactive ion etching

Jin Han, Tae Gon Kim, Byung-Kwon Min, Sang Jo Lee

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Recently, demands for nanochannels have been increasing in biological and nanofluidic applications. In this paper, a fabrication process that produces a nanochannel with a width of less than 20 nm and a high aspect ratio is proposed. For the versatility of channel pattern design, focused ion beam (FIB) direct writing is applied for mask fabrication. A metal mask pattern is fabricated using localized ion implantation method and is used for a deep reactive ion etching (DRIE) process. A process condition for minimum undercut in the DRIE process is determined. The proposed method is applied to the fabrication of nanochannels with various dimension and patterns.

Original languageEnglish
JournalJapanese Journal of Applied Physics
Volume49
Issue number6 PART 2
DOIs
Publication statusPublished - 2010 Jun 1

Fingerprint

Focused ion beams
Reactive ion etching
high aspect ratio
Ion implantation
Aspect ratio
implantation
ion beams
etching
Fabrication
Silicon
fabrication
Masks
silicon
Substrates
masks
Nanofluidics
ions
versatility
ion implantation
Metals

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

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AU - Han, Jin

AU - Kim, Tae Gon

AU - Min, Byung-Kwon

AU - Lee, Sang Jo

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AB - Recently, demands for nanochannels have been increasing in biological and nanofluidic applications. In this paper, a fabrication process that produces a nanochannel with a width of less than 20 nm and a high aspect ratio is proposed. For the versatility of channel pattern design, focused ion beam (FIB) direct writing is applied for mask fabrication. A metal mask pattern is fabricated using localized ion implantation method and is used for a deep reactive ion etching (DRIE) process. A process condition for minimum undercut in the DRIE process is determined. The proposed method is applied to the fabrication of nanochannels with various dimension and patterns.

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