Fabrication of nanochannels with high aspect ratios on a silicon substrate by local focused ion beam implantation and deep reactive ion etching

Jin Han, Tae Gon Kim, Byung Kwon Min, Sang Jo Lee

Research output: Contribution to journalArticle

4 Citations (Scopus)


Recently, demands for nanochannels have been increasing in biological and nanofluidic applications. In this paper, a fabrication process that produces a nanochannel with a width of less than 20 nm and a high aspect ratio is proposed. For the versatility of channel pattern design, focused ion beam (FIB) direct writing is applied for mask fabrication. A metal mask pattern is fabricated using localized ion implantation method and is used for a deep reactive ion etching (DRIE) process. A process condition for minimum undercut in the DRIE process is determined. The proposed method is applied to the fabrication of nanochannels with various dimension and patterns.

Original languageEnglish
Pages (from-to)06GK041-06GK043
JournalJapanese Journal of Applied Physics
Issue number6 PART 2
Publication statusPublished - 2010 Jun 1


All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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