Fabrication technique of a compressible biocompatible interconnect using a thin film transfer process

A. A.A. Aarts, O. Srivannavit, K. D. Wise, E. Yoon, R. Puers, C. Van Hoof, H. P. Neves

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

A compressible multifunctional interconnect for out-of-plane MEMS structures has been fabricated using a thin film transfer bonding technique and bio-tolerable materials. The bulk material of the stretchable film consists of photo-patternable poly-dimethylsiloxane and is fabricated on a carrier substrate. The film is bonded to a slim-base platform. The carrier substrate of the thin film is released using an aluminum anodic dissolution technique. Probe arrays can be assembled perpendicularly into a slim-base platform. Once the probes are assembled a non-separable electrical connection is established.

Original languageEnglish
Article number074012
JournalJournal of Micromechanics and Microengineering
Volume21
Issue number7
DOIs
Publication statusPublished - 2011 Jul 1

Fingerprint

Fabrication
Thin films
Substrates
Polydimethylsiloxane
Aluminum
MEMS
Dissolution
baysilon

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Aarts, A. A.A. ; Srivannavit, O. ; Wise, K. D. ; Yoon, E. ; Puers, R. ; Van Hoof, C. ; Neves, H. P. / Fabrication technique of a compressible biocompatible interconnect using a thin film transfer process. In: Journal of Micromechanics and Microengineering. 2011 ; Vol. 21, No. 7.
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Fabrication technique of a compressible biocompatible interconnect using a thin film transfer process. / Aarts, A. A.A.; Srivannavit, O.; Wise, K. D.; Yoon, E.; Puers, R.; Van Hoof, C.; Neves, H. P.

In: Journal of Micromechanics and Microengineering, Vol. 21, No. 7, 074012, 01.07.2011.

Research output: Contribution to journalArticle

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