A compressible multifunctional interconnect for out-of-plane MEMS structures has been fabricated using a thin film transfer bonding technique and bio-tolerable materials. The bulk material of the stretchable film consists of photo-patternable poly-dimethylsiloxane and is fabricated on a carrier substrate. The film is bonded to a slim-base platform. The carrier substrate of the thin film is released using an aluminum anodic dissolution technique. Probe arrays can be assembled perpendicularly into a slim-base platform. Once the probes are assembled a non-separable electrical connection is established.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering