Fabrication technique of a compressible biocompatible interconnect using a thin film transfer process

A. A.A. Aarts, O. Srivannavit, K. D. Wise, E. Yoon, R. Puers, C. Van Hoof, H. P. Neves

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

A compressible multifunctional interconnect for out-of-plane MEMS structures has been fabricated using a thin film transfer bonding technique and bio-tolerable materials. The bulk material of the stretchable film consists of photo-patternable poly-dimethylsiloxane and is fabricated on a carrier substrate. The film is bonded to a slim-base platform. The carrier substrate of the thin film is released using an aluminum anodic dissolution technique. Probe arrays can be assembled perpendicularly into a slim-base platform. Once the probes are assembled a non-separable electrical connection is established.

Original languageEnglish
Article number074012
JournalJournal of Micromechanics and Microengineering
Volume21
Issue number7
DOIs
Publication statusPublished - 2011 Jul 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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