Filled via hole fences for crosstalk control of microstrip lines in LTCC packages

George E. Ponchak, Donghoon Chen, Jong Gwan Yook, Linda P.B. Katehi

Research output: Contribution to journalConference article

2 Citations (Scopus)

Abstract

Coupling between microstrip lines in dense RF packages is a common problem that degrades the circuit performance. To help alleviate this problem, metal filled via hole fences may be placed on both sides of the microstrip to provide better field confinement. In this paper, a 3D-FEM electromagnetic simulation of the problem is presented and it is shown that a single role of vias provides no reduction in the crosstalk. However, by connecting the tops of the vias with a single metal strip, the crosstalk may be reduced by 8-10 dB.

Original languageEnglish
Pages (from-to)185-189
Number of pages5
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3582
Publication statusPublished - 1998 Dec 1
EventProceedings of the 1998 International Symposium on Microelectronics - San Diego, CA, USA
Duration: 1998 Nov 11998 Nov 4

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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