Flexible and embedded packaging of thinned silicon chip

Kyu Ho Shin, Chang Ryoul Moon, Tae Hee Lee, Yong Jun Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The trend of minimizing the system size and integration of various functions into a single device continues to grow. To achieve smaller, faster and more reliable devices, we would like to introduce the CEFP (Chip Embedded Flexible Packaging) technology. The CEFP is a system integration of flexible active devices and passive components on a flexible substrate. The CEFP technology can provide a flexible wireless platform for many applications. The entire module consists of a thinned silicon chip mounted onto the flexible platform and this kind of construction enables it to bend the package in various directions. Also, CEFP technology provides the opportunity for increasing packaging density and shrinking geometrical size. This paper presents the investigation of the mechanical characteristics of the flexible package based on FEA (Finite Element Analysis) and bending tests.

Original languageEnglish
Title of host publicationInternational Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005
Subtitle of host publicationEverything in Electronics Between the Chip and the System
Pages224-228
Number of pages5
Publication statusPublished - 2005 Dec 1
Event1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System - Scottsdale, AZ, United States
Duration: 2005 Mar 132005 Mar 16

Publication series

NameInternational Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System

Other

Other1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System
CountryUnited States
CityScottsdale, AZ
Period05/3/1305/3/16

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Shin, K. H., Moon, C. R., Lee, T. H., & Kim, Y. J. (2005). Flexible and embedded packaging of thinned silicon chip. In International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System (pp. 224-228). (International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System).