TY - GEN
T1 - Flexible and embedded packaging of thinned silicon chip
AU - Shin, Kyu Ho
AU - Moon, Chang Ryoul
AU - Lee, Tae Hee
AU - Kim, Yong Jun
PY - 2005
Y1 - 2005
N2 - The trend of minimizing the system size and integration of various functions into a single device continues to grow. To achieve smaller, faster and more reliable devices, we would like to introduce the CEFP (Chip Embedded Flexible Packaging) technology. The CEFP is a system integration of flexible active devices and passive components on a flexible substrate. The CEFP technology can provide a flexible wireless platform for many applications. The entire module consists of a thinned silicon chip mounted onto the flexible platform and this kind of construction enables it to bend the package in various directions. Also, CEFP technology provides the opportunity for increasing packaging density and shrinking geometrical size. This paper presents the investigation of the mechanical characteristics of the flexible package based on FEA (Finite Element Analysis) and bending tests.
AB - The trend of minimizing the system size and integration of various functions into a single device continues to grow. To achieve smaller, faster and more reliable devices, we would like to introduce the CEFP (Chip Embedded Flexible Packaging) technology. The CEFP is a system integration of flexible active devices and passive components on a flexible substrate. The CEFP technology can provide a flexible wireless platform for many applications. The entire module consists of a thinned silicon chip mounted onto the flexible platform and this kind of construction enables it to bend the package in various directions. Also, CEFP technology provides the opportunity for increasing packaging density and shrinking geometrical size. This paper presents the investigation of the mechanical characteristics of the flexible package based on FEA (Finite Element Analysis) and bending tests.
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M3 - Conference contribution
AN - SCOPUS:84878232390
SN - 9781604235722
T3 - International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System
SP - 224
EP - 228
BT - International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005
T2 - 1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System
Y2 - 13 March 2005 through 16 March 2005
ER -