Flexible biocompatible electronic systems that leverage key materials and manufacturing techniques associated with the consumer electronics industry have potential for broad applications in biomedicine and biological research. This study reports scalable approaches to technologies of this type where thin microscale device components integrate onto flexible polymer substrates in interconnected arrays to provide multimodal high performance operational capabilities as intimately coupled biointerfaces. Specificially the material options and engineering schemes summarized here serve as foundations for diverse heterogeneously integrated systems. Scaled examples incorporate >32,000 silicon microdie and inorganic microscale light-emitting diodes derived from wafer sources distributed at variable pitch spacings and fill factors across large areas on polymer films at full organ-scale dimensions such as human brain over ~150 cm2. In vitro studies and accelerated testing in simulated biofluids together with theoretical simulations of underlying processes yield quantitative insights into the key materials aspects. The results suggest an ability of these systems to operate in a biologically safe stable fashion with projected lifetimes of several decades without leakage currents or reductions in performance. The versatility of these combined concepts suggests applicability to many classes of biointegrated semiconductor devices.
|Number of pages||9|
|Journal||Proceedings of the National Academy of Sciences of the United States of America|
|Publication status||Published - 2019 Jul 30|
Bibliographical noteFunding Information:
ACKNOWLEDGMENTS. This work was supported by the Center for Bio-Integrated Electronics at Northwestern University. We acknowledge the use of facilities in the Micro and Nanotechnology Laboratory for device fabrication and the Frederick Seitz Materials Research Laboratory for Advanced Science and Technology for device measurement at the University of Illinois at Urbana–Champaign. R.L. acknowledges the support from the Young Elite Scientists Sponsorship Program by China Association for Science and Technology (2015QNRC001), LiaoNing Revitalization Talents Program (XLYC1807126), and Fundamental Research Funds for the Central Universities of China (DUT18GF101).
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