Flexible encapsulation materials based on silica aerogels for organic light-emitting diodes

Huanyu Zhou, Jin Hoon Kim, Kyoung Hyun Kim, Choon Soo Han, Jong Chul Park, jin woo Park

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

In this study, we present flexible encapsulation materials using silica aerogels for organic light-emitting diodes (OLEDs). The encapsulation consists of three layers: a superhydrophobic film of silica aerogels and polydimethylsiloxane (PDMS), an organic interlayer of polystyrene (PS), and a dense oxide layer of ZnO. The superhydrophobic film limits the contact with moisture, and the water vapor transmission rate (WVTR) can be further reduced by inserting a PS-covered ZnO layer between the substrate and the silica aerogel/PDMS composite layer. The PS interlayer was used to block the pathway for moisture diffusion through pinholes in ZnO. Trimethylchlorosilane (TMCS) was added to the superhydrophobic film as the silylation agent to remove the residual hydroxyl group on the surface of the aerogel. The chemical modification of aerogel surfaces was confirmed using Fourier transform infrared spectroscopy (FTIR). The superhydrophobicity, WVTR, and pore size of encapsulation materials were analyzed via the contact angle, MOCON test, and BET, respectively. The mechanical flexibility of the encapsulation was evaluated using the cyclic bending test and contact angle measurement. After 2000 bending cycles at a 10 mm bending radius, the contact angle was maintained at 180°. OLEDs were fabricated with and without the encapsulation, and the lifetime was measured and compared. For the encapsulation with a WVTR of 0.022 g/m2. day, the OLED showed a consistent performance for 7 hours, which is comparable to that of an OLED with the conventional glass lid encapsulation.

Original languageEnglish
Pages (from-to)11569-11574
Number of pages6
JournalJournal of Nanoscience and Nanotechnology
Volume16
Issue number11
DOIs
Publication statusPublished - 2016 Jan 1

Fingerprint

Aerogels
aerogels
Organic light emitting diodes (OLED)
Encapsulation
Silicon Dioxide
Polystyrenes
Steam
light emitting diodes
Silica
silicon dioxide
Light
water vapor
polystyrene
Water vapor
Contact angle
moisture
interlayers
Polydimethylsiloxane
Fourier Transform Infrared Spectroscopy
Hydroxyl Radical

All Science Journal Classification (ASJC) codes

  • Bioengineering
  • Chemistry(all)
  • Biomedical Engineering
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Zhou, Huanyu ; Kim, Jin Hoon ; Kim, Kyoung Hyun ; Han, Choon Soo ; Park, Jong Chul ; Park, jin woo. / Flexible encapsulation materials based on silica aerogels for organic light-emitting diodes. In: Journal of Nanoscience and Nanotechnology. 2016 ; Vol. 16, No. 11. pp. 11569-11574.
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Flexible encapsulation materials based on silica aerogels for organic light-emitting diodes. / Zhou, Huanyu; Kim, Jin Hoon; Kim, Kyoung Hyun; Han, Choon Soo; Park, Jong Chul; Park, jin woo.

In: Journal of Nanoscience and Nanotechnology, Vol. 16, No. 11, 01.01.2016, p. 11569-11574.

Research output: Contribution to journalArticle

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AU - Kim, Jin Hoon

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