Flexible polysilicon sensor array modules using "etch-release" packaging scheme

Eun Soo Hwang, Yong-Jun Kim, Byeong Kwon Ju

Research output: Contribution to journalConference article

13 Citations (Scopus)

Abstract

A flexible polysilicon strain gauge array has been designed and fabricated using surface-micromachining with a SiO2 sacrificial layer. The realized sensor array is mechanically flexible, which can be attached on a non-planar surface. To realize the flexible polysilicon strain gauge array, a new packaging scheme using polysilicon/oxide-based surface-micromachining was developed. The proposed packaging scheme completes the strain sensor and the circuit board on a single process, which eliminates additional assembly and alignment problems. The measured gauge factor shows that it is more sensitive than conventional metal strain gauges. Unlike a single-crystal silicon strain gauge, a crystal direction does not affect its sensitivity in a polysilicon sensor, and this isotropic property makes the realization of an omni-directional strain gauge array possible. The proposed flexible strain sensor array can be used in a measurement of stress distribution of an arbitrary and non-planar surface.

Original languageEnglish
Pages (from-to)135-141
Number of pages7
JournalSensors and Actuators, A: Physical
Volume111
Issue number1
DOIs
Publication statusPublished - 2004 Mar 1
EventMicromechanics Section of Sensors and Actuators, based on - Kyoto, Japan
Duration: 2003 Jan 192003 Jan 23

Fingerprint

strain gages
Sensor arrays
Strain gages
Polysilicon
packaging
Packaging
modules
sensors
Surface micromachining
micromachining
Sensors
circuit boards
Silicon
Oxides
stress distribution
Gages
Stress concentration
assembly
Metals
alignment

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Instrumentation

Cite this

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Flexible polysilicon sensor array modules using "etch-release" packaging scheme. / Hwang, Eun Soo; Kim, Yong-Jun; Ju, Byeong Kwon.

In: Sensors and Actuators, A: Physical, Vol. 111, No. 1, 01.03.2004, p. 135-141.

Research output: Contribution to journalConference article

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