Flexible Water-proof Bio-Integrated Electronics

Mingyu Sang, Ki Jun Yu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Due to the absence of thin-film barriers to biofluids with multidecade lifetimes, the penetration of biofluids into the devices and any ensuing electrochemical reactions pose significant safety risks. Here, we overcome these challenges by combining pristine thermal SiO2 layers with processing steps for their integration onto flexible electronics. We showed that an ultrathin, leakage-free, biocompatible dielectric layer which can completely seal the device. The resulting current-leakage levels and operational lifetimes have been improved significantly.

Original languageEnglish
Title of host publication2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages16-19
Number of pages4
ISBN (Electronic)9781538665084
DOIs
Publication statusPublished - 2019 Mar
Event2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 - Singapore, Singapore
Duration: 2019 Mar 122019 Mar 15

Publication series

Name2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019

Conference

Conference2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019
CountrySingapore
CitySingapore
Period19/3/1219/3/15

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Hardware and Architecture

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  • Cite this

    Sang, M., & Yu, K. J. (2019). Flexible Water-proof Bio-Integrated Electronics. In 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019 (pp. 16-19). [8731044] (2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDTM.2019.8731044