Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array

Sun Il Chang, Hyung Kew Lee, Euisik Yoon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, we have proposed and demonstrated a new assembly scheme for hybrid integration of readout circuits on soft polymer substrate, and a universal readout circuit chip for modular expandable tactile sensor array. A flip-chip assembly process using ACP (Anisotropic Conductive Paste) has been applied to the hybrid assembly between the fabricated chips and the embedded interconnection lines on soft polymer substrate. Contact resistance has been measured less than 0.1 Ω. By applying a universal readout circuit architecture and successfully integrating it with tactile sensor arrays using the proposed flip-chip assembly process, the proposed tactile sensor module could be expanded in a large area such as artificial skin.

Original languageEnglish
Title of host publicationTRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers
Pages1969-1972
Number of pages4
Publication statusPublished - 2005 Nov 9
Event13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05 - Seoul, Korea, Republic of
Duration: 2005 Jun 52005 Jun 9

Publication series

NameDigest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05
Volume2

Other

Other13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05
CountryKorea, Republic of
CitySeoul
Period05/6/505/6/9

Fingerprint

Sensor arrays
Polymers
Substrates
Networks (circuits)
Contact resistance
Skin
Sensors

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Chang, S. I., Lee, H. K., & Yoon, E. (2005). Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array. In TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers (pp. 1969-1972). [4B1.2] (Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05; Vol. 2).
Chang, Sun Il ; Lee, Hyung Kew ; Yoon, Euisik. / Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array. TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers. 2005. pp. 1969-1972 (Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05).
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abstract = "In this paper, we have proposed and demonstrated a new assembly scheme for hybrid integration of readout circuits on soft polymer substrate, and a universal readout circuit chip for modular expandable tactile sensor array. A flip-chip assembly process using ACP (Anisotropic Conductive Paste) has been applied to the hybrid assembly between the fabricated chips and the embedded interconnection lines on soft polymer substrate. Contact resistance has been measured less than 0.1 Ω. By applying a universal readout circuit architecture and successfully integrating it with tactile sensor arrays using the proposed flip-chip assembly process, the proposed tactile sensor module could be expanded in a large area such as artificial skin.",
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series = "Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05",
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Chang, SI, Lee, HK & Yoon, E 2005, Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array. in TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers., 4B1.2, Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05, vol. 2, pp. 1969-1972, 13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05, Seoul, Korea, Republic of, 05/6/5.

Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array. / Chang, Sun Il; Lee, Hyung Kew; Yoon, Euisik.

TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers. 2005. p. 1969-1972 4B1.2 (Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05; Vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chang SI, Lee HK, Yoon E. Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array. In TRANSDUCERS '05 - 13th International Conference on Solid-State Sensors and Actuators and Microsystems - Digest of Technical Papers. 2005. p. 1969-1972. 4B1.2. (Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05).