Fluidic manipulation and self-assembly of microdevices in railed microfluidic channels

Su Eun Chung, Seung Ah Lee, Jiyun Kim, Sunghoon Kwon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We demonstrate fluidic manipulation and assembly of silicon microchips by creatively combining railed microfluidics and computer-vision aided dynamic chip packaging. Externally fabricated silicon microchips are fluidically guided and selfassembled, potentially enabling low cost fluidic packaging of integrated circuits.

Original languageEnglish
Title of host publication2008 International SoC Design Conference, ISOCC 2008
PagesI318-I321
DOIs
Publication statusPublished - 2008
Event2008 International SoC Design Conference, ISOCC 2008 - Busan, Korea, Republic of
Duration: 2008 Nov 242008 Nov 25

Publication series

Name2008 International SoC Design Conference, ISOCC 2008
Volume1

Other

Other2008 International SoC Design Conference, ISOCC 2008
CountryKorea, Republic of
CityBusan
Period08/11/2408/11/25

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Software

Fingerprint Dive into the research topics of 'Fluidic manipulation and self-assembly of microdevices in railed microfluidic channels'. Together they form a unique fingerprint.

  • Cite this

    Chung, S. E., Lee, S. A., Kim, J., & Kwon, S. (2008). Fluidic manipulation and self-assembly of microdevices in railed microfluidic channels. In 2008 International SoC Design Conference, ISOCC 2008 (pp. I318-I321). [4815636] (2008 International SoC Design Conference, ISOCC 2008; Vol. 1). https://doi.org/10.1109/SOCDC.2008.4815636