Foldable three dimensional neural electrode arrays for simultaneous brain interfacing of cortical surface and intracortical multilayers

Ju Young Lee, Sang Hoon Park, Yujin Kim, Young Uk Cho, Jaejin Park, Jung Hoon Hong, Kyubeen Kim, Jongwoon Shin, Jeong Eun Ju, In Sik Min, Mingyu Sang, Hyogeun Shin, Ui Jin Jeong, Yuyan Gao, Bowen Li, Aizhan Zhumbayeva, Kyung Yeun Kim, Eun Bin Hong, Min Ho Nam, Hojeong JeonYoungmee Jung, Huanyu Cheng, Il Joo Cho, Ki Jun Yu

Research output: Contribution to journalArticlepeer-review


Challenges in the understanding of three-dimensional (3D) brain networks by simultaneously recording both surface and intracortical areas of brain signals remain due to the difficulties of constructing mechanical design and spatial limitations of the implanted sites. Here, we present a foldable and flexible 3D neural prosthetic that facilitates the 3D mapping of complex neural circuits with high spatiotemporal dynamics from the intracortical to cortical region. This device is the tool to map the 3D neural transmission through sophisticatedly designed four flexible penetrating shanks and surface electrode arrays in one integrated system. We demonstrate the potential possibilities of identifying correlations of neural activities from the intracortical area to cortical regions through continuous monitoring of electrophysiological signals. We also exploited the structural properties of the device to record synchronized signals of single spikes evoked by unidirectional total whisker stimulation. This platform offers opportunities to clarify unpredictable 3D neural pathways and provides a next-generation neural interface.

Original languageEnglish
Article number86
Journalnpj Flexible Electronics
Issue number1
Publication statusPublished - 2022 Dec

Bibliographical note

Funding Information:
This work acknowledges the support received from the National Research Foundation of Korea (Grant Nos. NRF-2019R1A2C2086085, NRF-2021R1A4A1031437, and NRF-2018M3A7B4071109). H.C. also acknowledges the support provided by the National Institutes of Health (Award Nos. R21EB030140, U01DA056242, and R61HL154215).

Publisher Copyright:
© 2022, The Author(s).

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Electrical and Electronic Engineering


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