Fracture behavior simulation using multi-scale analysis scheme under various thermal conditions

Juwhan Kim, Yun Mook Lim, Kunwhi Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A series of fracture simulations are performed and presented. A two dimensional configuration with a notch is assembled via the popular Lennard-Jones (LJ) potential, and the configuration is subjected to displacement controlled tension tests. Five sets of analyses are performed at different temperatures, where the specimens share the same initial geometry and particle number and strain rate is fixed at the same value. Results show qualitatively that a heightened temperature may induce retardation of crack propagation, and consequently an increase in material toughness. Peak stress response is shown to increase with ambient temperature, and the trend coincides with what is commonly observed in actual toughness tests. What is also shown is local heating around crack tips. The local temperature variance is observed to concentrate behind the crack tip, i.e., deferred heat transfer. The localized heating appears more pronounced in the lower ambient temperature cases, while the effect becomes less susceptible in the higher ambient temperature cases. The phenomenon may be related to higher mobile states of particles induced by increased internal energy.

Original languageEnglish
Title of host publicationMultiscale and Functionally Graded Materials - Proceedings of the International Conference, FGM IX
Pages100-105
Number of pages6
DOIs
Publication statusPublished - 2008 Mar 13
Event9th International Conference on Multiscale and Functionally Graded Materials, FGM IX - Oahu Island, HI, United States
Duration: 2006 Oct 152006 Oct 18

Publication series

NameAIP Conference Proceedings
Volume973
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

Other9th International Conference on Multiscale and Functionally Graded Materials, FGM IX
CountryUnited States
CityOahu Island, HI
Period06/10/1506/10/18

Fingerprint

ambient temperature
crack tips
toughness
heating
simulation
Lennard-Jones potential
crack propagation
notches
configurations
internal energy
strain rate
temperature
heat transfer
trends
geometry

All Science Journal Classification (ASJC) codes

  • Ecology, Evolution, Behavior and Systematics
  • Ecology
  • Plant Science
  • Physics and Astronomy(all)
  • Nature and Landscape Conservation

Cite this

Kim, J., Lim, Y. M., & Kim, K. (2008). Fracture behavior simulation using multi-scale analysis scheme under various thermal conditions. In Multiscale and Functionally Graded Materials - Proceedings of the International Conference, FGM IX (pp. 100-105). (AIP Conference Proceedings; Vol. 973). https://doi.org/10.1063/1.2896759
Kim, Juwhan ; Lim, Yun Mook ; Kim, Kunwhi. / Fracture behavior simulation using multi-scale analysis scheme under various thermal conditions. Multiscale and Functionally Graded Materials - Proceedings of the International Conference, FGM IX. 2008. pp. 100-105 (AIP Conference Proceedings).
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Kim, J, Lim, YM & Kim, K 2008, Fracture behavior simulation using multi-scale analysis scheme under various thermal conditions. in Multiscale and Functionally Graded Materials - Proceedings of the International Conference, FGM IX. AIP Conference Proceedings, vol. 973, pp. 100-105, 9th International Conference on Multiscale and Functionally Graded Materials, FGM IX, Oahu Island, HI, United States, 06/10/15. https://doi.org/10.1063/1.2896759

Fracture behavior simulation using multi-scale analysis scheme under various thermal conditions. / Kim, Juwhan; Lim, Yun Mook; Kim, Kunwhi.

Multiscale and Functionally Graded Materials - Proceedings of the International Conference, FGM IX. 2008. p. 100-105 (AIP Conference Proceedings; Vol. 973).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Kim J, Lim YM, Kim K. Fracture behavior simulation using multi-scale analysis scheme under various thermal conditions. In Multiscale and Functionally Graded Materials - Proceedings of the International Conference, FGM IX. 2008. p. 100-105. (AIP Conference Proceedings). https://doi.org/10.1063/1.2896759