Frictional behavior of Ag nanodot-pattern fabricated by thermal dewetting

Hyun Joon Kim, Dae Eun Kim

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

The frictional behavior of a Ag nanodot-pattern fabricated on a silicon substrate by the thermal dewetting process was investigated. The motivation was to decrease the micro/nano-scale friction of thin films by utilizing nano-patterns to control the real contact area. A Ag thin film of 20. nm in thickness was initially deposited on a silicon wafer by RF sputtering. Then, a thermal dewetting process was carried out at annealing temperatures ranging from 250 to 550 °C in order to fabricate patterns with different morphologies. As a result, hemispherical shaped Ag nanodot-patterns could be fabricated on the silicon wafer. Friction tests were performed using an atomic force microscope (AFM) with a 44 μm diameter micro-sphere attached to the tip of the cantilever. Both initial and steady state frictional forces were measured. It was found that the frictional force of nanodot-patterned specimens was significantly lower than that of the smooth Ag film. Moreover, there was an optimum annealing temperature that resulted in the lowest friction coefficient. The effect of contact area on the frictional force was also assessed based on the experimental results and contact analysis.

Original languageEnglish
Pages (from-to)234-240
Number of pages7
JournalSurface and Coatings Technology
Volume215
DOIs
Publication statusPublished - 2013 Jan 25

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drying
Friction
Silicon wafers
Annealing
Thin films
silicon
friction
wafers
Silicon
annealing
Sputtering
Microscopes
thin films
coefficient of friction
Temperature
sputtering
microscopes
Substrates
temperature
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

@article{fc82dd3289b04a239a626335f9c07950,
title = "Frictional behavior of Ag nanodot-pattern fabricated by thermal dewetting",
abstract = "The frictional behavior of a Ag nanodot-pattern fabricated on a silicon substrate by the thermal dewetting process was investigated. The motivation was to decrease the micro/nano-scale friction of thin films by utilizing nano-patterns to control the real contact area. A Ag thin film of 20. nm in thickness was initially deposited on a silicon wafer by RF sputtering. Then, a thermal dewetting process was carried out at annealing temperatures ranging from 250 to 550 °C in order to fabricate patterns with different morphologies. As a result, hemispherical shaped Ag nanodot-patterns could be fabricated on the silicon wafer. Friction tests were performed using an atomic force microscope (AFM) with a 44 μm diameter micro-sphere attached to the tip of the cantilever. Both initial and steady state frictional forces were measured. It was found that the frictional force of nanodot-patterned specimens was significantly lower than that of the smooth Ag film. Moreover, there was an optimum annealing temperature that resulted in the lowest friction coefficient. The effect of contact area on the frictional force was also assessed based on the experimental results and contact analysis.",
author = "Kim, {Hyun Joon} and Kim, {Dae Eun}",
year = "2013",
month = "1",
day = "25",
doi = "10.1016/j.surfcoat.2012.05.146",
language = "English",
volume = "215",
pages = "234--240",
journal = "Surface and Coatings Technology",
issn = "0257-8972",
publisher = "Elsevier",

}

Frictional behavior of Ag nanodot-pattern fabricated by thermal dewetting. / Kim, Hyun Joon; Kim, Dae Eun.

In: Surface and Coatings Technology, Vol. 215, 25.01.2013, p. 234-240.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Frictional behavior of Ag nanodot-pattern fabricated by thermal dewetting

AU - Kim, Hyun Joon

AU - Kim, Dae Eun

PY - 2013/1/25

Y1 - 2013/1/25

N2 - The frictional behavior of a Ag nanodot-pattern fabricated on a silicon substrate by the thermal dewetting process was investigated. The motivation was to decrease the micro/nano-scale friction of thin films by utilizing nano-patterns to control the real contact area. A Ag thin film of 20. nm in thickness was initially deposited on a silicon wafer by RF sputtering. Then, a thermal dewetting process was carried out at annealing temperatures ranging from 250 to 550 °C in order to fabricate patterns with different morphologies. As a result, hemispherical shaped Ag nanodot-patterns could be fabricated on the silicon wafer. Friction tests were performed using an atomic force microscope (AFM) with a 44 μm diameter micro-sphere attached to the tip of the cantilever. Both initial and steady state frictional forces were measured. It was found that the frictional force of nanodot-patterned specimens was significantly lower than that of the smooth Ag film. Moreover, there was an optimum annealing temperature that resulted in the lowest friction coefficient. The effect of contact area on the frictional force was also assessed based on the experimental results and contact analysis.

AB - The frictional behavior of a Ag nanodot-pattern fabricated on a silicon substrate by the thermal dewetting process was investigated. The motivation was to decrease the micro/nano-scale friction of thin films by utilizing nano-patterns to control the real contact area. A Ag thin film of 20. nm in thickness was initially deposited on a silicon wafer by RF sputtering. Then, a thermal dewetting process was carried out at annealing temperatures ranging from 250 to 550 °C in order to fabricate patterns with different morphologies. As a result, hemispherical shaped Ag nanodot-patterns could be fabricated on the silicon wafer. Friction tests were performed using an atomic force microscope (AFM) with a 44 μm diameter micro-sphere attached to the tip of the cantilever. Both initial and steady state frictional forces were measured. It was found that the frictional force of nanodot-patterned specimens was significantly lower than that of the smooth Ag film. Moreover, there was an optimum annealing temperature that resulted in the lowest friction coefficient. The effect of contact area on the frictional force was also assessed based on the experimental results and contact analysis.

UR - http://www.scopus.com/inward/record.url?scp=84872680258&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84872680258&partnerID=8YFLogxK

U2 - 10.1016/j.surfcoat.2012.05.146

DO - 10.1016/j.surfcoat.2012.05.146

M3 - Article

AN - SCOPUS:84872680258

VL - 215

SP - 234

EP - 240

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

SN - 0257-8972

ER -