Abstract
Here we demonstrate fully-integrated, bezel-less transistor arrays using stretchable origami substrates and foldable conducting interconnects. Reversible folding of these arrays is enabled by origami substrates which are composed of rigid support fixtures and foldable elastic joints. In addition, hybrid structures of thin metal films and metallic nanowires worked as foldable interconnects which are located on the elastomeric joints.
| Original language | English |
|---|---|
| Pages (from-to) | 9504-9510 |
| Number of pages | 7 |
| Journal | Nanoscale |
| Volume | 8 |
| Issue number | 18 |
| DOIs | |
| Publication status | Published - 2016 May 14 |
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All Science Journal Classification (ASJC) codes
- Materials Science(all)
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Fully-integrated, bezel-less transistor arrays using reversibly foldable interconnects and stretchable origami substrates. / Kim, Mijung; Park, Jihun; Ji, Sangyoon; Shin, Sung Ho; Kim, So Yun; Kim, Young Cheon; Kim, Ju Young; Park, Jang Ung.
In: Nanoscale, Vol. 8, No. 18, 14.05.2016, p. 9504-9510.Research output: Contribution to journal › Article
TY - JOUR
T1 - Fully-integrated, bezel-less transistor arrays using reversibly foldable interconnects and stretchable origami substrates
AU - Kim, Mijung
AU - Park, Jihun
AU - Ji, Sangyoon
AU - Shin, Sung Ho
AU - Kim, So Yun
AU - Kim, Young Cheon
AU - Kim, Ju Young
AU - Park, Jang Ung
PY - 2016/5/14
Y1 - 2016/5/14
N2 - Here we demonstrate fully-integrated, bezel-less transistor arrays using stretchable origami substrates and foldable conducting interconnects. Reversible folding of these arrays is enabled by origami substrates which are composed of rigid support fixtures and foldable elastic joints. In addition, hybrid structures of thin metal films and metallic nanowires worked as foldable interconnects which are located on the elastomeric joints.
AB - Here we demonstrate fully-integrated, bezel-less transistor arrays using stretchable origami substrates and foldable conducting interconnects. Reversible folding of these arrays is enabled by origami substrates which are composed of rigid support fixtures and foldable elastic joints. In addition, hybrid structures of thin metal films and metallic nanowires worked as foldable interconnects which are located on the elastomeric joints.
UR - http://www.scopus.com/inward/record.url?scp=84971622476&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84971622476&partnerID=8YFLogxK
U2 - 10.1039/c6nr02041k
DO - 10.1039/c6nr02041k
M3 - Article
AN - SCOPUS:84971622476
VL - 8
SP - 9504
EP - 9510
JO - Nanoscale
JF - Nanoscale
SN - 2040-3364
IS - 18
ER -