Here we demonstrate fully-integrated, bezel-less transistor arrays using stretchable origami substrates and foldable conducting interconnects. Reversible folding of these arrays is enabled by origami substrates which are composed of rigid support fixtures and foldable elastic joints. In addition, hybrid structures of thin metal films and metallic nanowires worked as foldable interconnects which are located on the elastomeric joints.
Bibliographical noteFunding Information:
This work was supported by the Ministry of Science, ICT & Future Planning and the Ministry of Trade, Industry and Energy (MOTIE) of Korea through the Basic Science Research Program of National Research Foundation (2013R1A2A2A01068542), the Technology Innovation Program (Grant 10044410), the Nano Material Technology Development Program (2015M3A7B4050308), the Convergence Technology Development Program for Bionic Arm (NRF-2014M3C1B2048198), the Pioneer Research Center Program (NRF-2014M3C1A3001208), and the Development Program of Interconnection System and Process for Flexible Three Dimensional Heterogeneous Devices (10052675). Also, the authors thank Samsung Display and financial support by the Development Program of Manufacturing Technology for Flexible Electronics with High Performance (SC0970) funded by Korea Institute of Machinery and Materials, and by the Development Program of Internet of Nature System (1.150090.01) funded by UNIST.
© 2016 The Royal Society of Chemistry.
All Science Journal Classification (ASJC) codes
- Materials Science(all)