Fully packaged finite-ground coplanar line-to-micromachined waveguide transition

James P. Becker, Yongshik Lee, Jack R. East, Linda P B Katehi

Research output: Contribution to conferencePaper

2 Citations (Scopus)

Abstract

A novel, fully packaged planar line-to-silicon micromachined waveguide transition is investigated. Measured results for a Ka-band transition to a conventional metal waveguide are given. Full-wave simulations on a modified structure transfer this design to W-band to demonstrate the potential for a fully packaged low-cost silicon counterpart.

Original languageEnglish
Pages273-276
Number of pages4
Publication statusPublished - 2000 Dec 1
Event9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA
Duration: 2000 Oct 232000 Oct 25

Other

Other9th Topical Meeting on Electrical Performance of Electronic Packaging
CityScottsdale, AZ, USA
Period00/10/2300/10/25

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All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Becker, J. P., Lee, Y., East, J. R., & Katehi, L. P. B. (2000). Fully packaged finite-ground coplanar line-to-micromachined waveguide transition. 273-276. Paper presented at 9th Topical Meeting on Electrical Performance of Electronic Packaging, Scottsdale, AZ, USA, .