Heat transfer enhancement of copper-water nanofluids in a lid-driven enclosure

M. Muthtamilselvan, P. Kandaswamy, J. Lee

Research output: Contribution to journalArticle

210 Citations (Scopus)

Abstract

A numerical study is conducted to investigate the transport mechanism of mixed convection in a lid-driven enclosure filled with nanofluids. The two vertical walls of the enclosure are insulated while the horizontal walls are kept at constant temperatures with the top surface moving at a constant speed. The numerical approach is based on the finite volume technique with a staggered grid arrangement. The SIMPLE algorithm is used for handling the pressure velocity coupling. Numerical solutions are obtained for a wide range of parameters and copper-water nanofluid is used with Pr = 6.2. The streamlines, isotherm plots and the variation of the average Nusselt number at the hot wall are presented and discussed. It is found that both the aspect ratio and solid volume fraction affect the fluid flow and heat transfer in the enclosure. Also, the variation of the average Nusselt number is linear with solid volume fraction. Crown

Original languageEnglish
Pages (from-to)1501-1510
Number of pages10
JournalCommunications in Nonlinear Science and Numerical Simulation
Volume15
Issue number6
DOIs
Publication statusPublished - 2010 Jun 1

Fingerprint

Heat Transfer Enhancement
Nanofluid
Enclosure
Enclosures
Copper
Nusselt number
Heat transfer
Water
Volume Fraction
Volume fraction
Staggered Grid
Mixed Convection
Mixed convection
Streamlines
Finite Volume
Aspect Ratio
Fluid Flow
Isotherms
Heat Transfer
Flow of fluids

All Science Journal Classification (ASJC) codes

  • Numerical Analysis
  • Modelling and Simulation
  • Applied Mathematics

Cite this

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Heat transfer enhancement of copper-water nanofluids in a lid-driven enclosure. / Muthtamilselvan, M.; Kandaswamy, P.; Lee, J.

In: Communications in Nonlinear Science and Numerical Simulation, Vol. 15, No. 6, 01.06.2010, p. 1501-1510.

Research output: Contribution to journalArticle

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