We propose a new technique to grow HfSi xO yHfO 2 film on Si substrate by using a 500°C process, and demonstrate the feasibility of multi-layered high-k oxide film (i.e., HfSi xO y-HfO 2) as alternative gate insulator for thin film transistors (TFTs). Hf metal films were directly deposited on Si wafers at substrate temperatures of 25 - 400°C by using a non-reactive rf-magnetron sputtering system. Oxidation at 500°C in dry O 2 ambient and subsequent annealing at the same temperature in N 2 ambient result in electrically stable multi-layered HfSi xO y-HfO 2 gate insulator for TFTs. We also investigate the effects of the substrate temperature on the physical and electrical properties of HfSi xO y-HfO 2 films, and show that substrate temperature must be set at 25°C for the sputtering of Hf metal films to obtain optimum electrical characteristics (e.g., high dielectric constant, no hysteresis phenomenon, and low leakage current).
|Journal||Journal of the Korean Physical Society|
|Issue number||SUPPL. 3|
|Publication status||Published - 2005 Nov|
All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)