High performance elevated thin film microstrip on polyimide-loaded silicon

Sang No Lee, Ok Guen Lim, Jong Gwan Yook, Yong Jun Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In this paper, low-loss thin film microstrip (TFMS) on CMOS-grade silicon is characterized where silicon substrate is loaded with low loss polyimide and additional air layers with surface micromachining technology. Characteristic impedances and attenuation constants are presented for various geometry parameters. Due to the additional air interface, the proposed TFMS supports near TEM-wave behavior and reveals extremely low-loss characteristics compared to conventional TFMS having only a thin polyimide interface. Furthermore, a step impedance low pass filter (LPF) is designed to prove the performance of the proposed TFMS line. Meandered high impedance lines are implemented within air interface for low-loss property, while low impedance lines are placed on polyimide layer for size reduction. Good agreement between simulated and measured results is obtained.

Original languageEnglish
Title of host publicationConference Proceedings - 33rd European Microwave Conference, EuMC 2003
PublisherIEEE Computer Society
Pages659-662
Number of pages4
ISBN (Print)1580538355, 9781580538350
DOIs
Publication statusPublished - 2003
Event33rd European Microwave Conference, EuMC 2003 - Munich, Germany
Duration: 2003 Oct 72003 Oct 7

Publication series

NameConference Proceedings - 33rd European Microwave Conference, EuMC 2003
Volume2

Other

Other33rd European Microwave Conference, EuMC 2003
CountryGermany
CityMunich
Period03/10/703/10/7

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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