High-Resolution 3D Printing for Electronics

Young Geun Park, Insik Yun, Won Gi Chung, Wonjung Park, Dong Ha Lee, Jang Ung Park

Research output: Contribution to journalReview articlepeer-review

Abstract

The ability to form arbitrary 3D structures provides the next level of complexity and a greater degree of freedom in the design of electronic devices. Since recent progress in electronics has expanded their applicability in various fields in which structural conformability and dynamic configuration are required, high-resolution 3D printing technologies can offer significant potential for freeform electronics. Here, the recent progress in novel 3D printing methods for freeform electronics is reviewed, with providing a comprehensive study on 3D-printable functional materials and processes for various device components. The latest advances in 3D-printed electronics are also reviewed to explain representative device components, including interconnects, batteries, antennas, and sensors. Furthermore, the key challenges and prospects for next-generation printed electronics are considered, and the future directions are explored based on research that has emerged recently.

Original languageEnglish
Article number2104623
JournalAdvanced Science
Volume9
Issue number8
DOIs
Publication statusPublished - 2022 Mar 15

Bibliographical note

Funding Information:
Y.‐G.P., I.Y., W.G.C., W.P., and D.H.L. contributed equally to this work. This work was supported by the Ministry of Trade, Industry and Energy (MOTIE) of Korea through the National Research Foundation for Nano Material Technology Development Program (2021M3H4A1A01079416 and 2021M3D1A204991411), the Bio and Medical Technology Development Program (2018M3A9F1021649), the Korea Initiative for fostering University of Research and Innovation (KIURI) Program (2020M3H1A1077207), and the Technology Innovation Program (20010366 and 20013621, Center for Super Critical Material Industrial Technology). Also, the authors thank financial support by Samsung Research Funding and Incubation Center of Samsung Electronics (SRFC‐TC2003‐03), the Institute for Basic Science (IBS‐R026‐D1) and Y.‐G.P. thanks the Sejong Science Fellowship (2021R1C1C2008657).

Publisher Copyright:
© 2022 The Authors. Advanced Science published by Wiley-VCH GmbH

All Science Journal Classification (ASJC) codes

  • Medicine (miscellaneous)
  • Chemical Engineering(all)
  • Materials Science(all)
  • Biochemistry, Genetics and Molecular Biology (miscellaneous)
  • Engineering(all)
  • Physics and Astronomy(all)

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