High thermoelectric performance of melt-spun CuxBi0.5Sb1.5Te3 by synergetic effect of carrier tuning and phonon engineering

Jeong Seop Yoon, Jae Min Song, Jamil Ur Rahman, Soonil Lee, Won Seon Seo, Kyu Hyoung Lee, Seyun Kim, Hyun Sik Kim, Sang il Kim, Weon Ho Shin

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)

Abstract

Bi-Te based materials have been used for near-room-temperature thermoelectric applications. However, their properties dramatically decrease at high temperatures (over 100 °C), limiting their use in power generation. In this study, we investigated the enhanced thermoelectric properties of Bi-Te based materials by Cu doping and employing the melt-spinning (MS) process that can be utilized especially at elevated temperatures. By changing the doping amount, we could modulate the temperature dependence of thermoelectric properties, where the maximum ZT temperature could be shifted from room temperature to 450 K. The highest ZT value, 1.34, was achieved at 400 K for 2% Cu-doped Bi0.5Sb1.5Te3, which is due to the enhancement in power factor and reduction in lattice thermal conductivity. The average ZT value between room temperature and 530 K was 1.17 for 2% Cu-doped Bi0.5Sb1.5Te3, which is 46% higher than that of pristine Bi0.5Sb1.5Te3. Consequently, the synergetic effect of MS process and Cu incorporation can be a promising method to widen the application of Bi-Te based thermoelectric materials for mid-temperature power generation.

Original languageEnglish
Pages (from-to)289-296
Number of pages8
JournalActa Materialia
Volume158
DOIs
Publication statusPublished - 2018 Oct 1

Bibliographical note

Funding Information:
This work was supported by a grant from the Fundamental R&D program for Core Technology of Materials ( 10048035 , 10083640 ) funded by the Ministry of Trade, Industry, and Energy (MOTIE), Korea , and by National Research Foundation of Korea ( NRF-2017R1D1A1B03034322 ).

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

Fingerprint Dive into the research topics of 'High thermoelectric performance of melt-spun Cu<sub>x</sub>Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub> by synergetic effect of carrier tuning and phonon engineering'. Together they form a unique fingerprint.

Cite this