Hybrid copper complex-derived conductive patterns printed on polyimide substrates

Byoungyoon Lee, Sooncheol Jeong, Yoonhyun Kim, Inbum Jeong, Kyoohee Woo, Joo Ho Moon

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

We synthesized new copper complexes that can be readily converted into highly conductive Cu film. Mechanochemical milling of copper (I) oxide suspended in formic acid resulted in the submicron-sized Cu formate together Cu nanoparticles. The submicrometer-sized Cu formates are reactive toward inter-particle sintering and metallic Cu seeds present in the Cu complexes assist their decomposition and the nucleation of Cu. The hybrid copper complex film printed on polyimide substrate is decomposed into dense and uniform Cu layer after annealing at 250 °C for 30 min under nitrogen atmosphere. The resulting Cu film exhibited a low resistivity of 8.2 μω·cm and good adhesion characteristics.

Original languageEnglish
Pages (from-to)493-498
Number of pages6
JournalMetals and Materials International
Volume18
Issue number3
DOIs
Publication statusPublished - 2012 Jun 1

Fingerprint

formic acid
polyimides
Polyimides
Copper
formates
copper
Substrates
Formates
Copper oxides
Formic acid
Seed
seeds
sintering
adhesion
Nucleation
Nitrogen
Sintering
Adhesion
nucleation
Annealing

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

Cite this

Lee, Byoungyoon ; Jeong, Sooncheol ; Kim, Yoonhyun ; Jeong, Inbum ; Woo, Kyoohee ; Moon, Joo Ho. / Hybrid copper complex-derived conductive patterns printed on polyimide substrates. In: Metals and Materials International. 2012 ; Vol. 18, No. 3. pp. 493-498.
@article{990942f3c9c44f208924e79b32bce938,
title = "Hybrid copper complex-derived conductive patterns printed on polyimide substrates",
abstract = "We synthesized new copper complexes that can be readily converted into highly conductive Cu film. Mechanochemical milling of copper (I) oxide suspended in formic acid resulted in the submicron-sized Cu formate together Cu nanoparticles. The submicrometer-sized Cu formates are reactive toward inter-particle sintering and metallic Cu seeds present in the Cu complexes assist their decomposition and the nucleation of Cu. The hybrid copper complex film printed on polyimide substrate is decomposed into dense and uniform Cu layer after annealing at 250 °C for 30 min under nitrogen atmosphere. The resulting Cu film exhibited a low resistivity of 8.2 μω·cm and good adhesion characteristics.",
author = "Byoungyoon Lee and Sooncheol Jeong and Yoonhyun Kim and Inbum Jeong and Kyoohee Woo and Moon, {Joo Ho}",
year = "2012",
month = "6",
day = "1",
doi = "10.1007/s12540-012-3017-z",
language = "English",
volume = "18",
pages = "493--498",
journal = "Metals and Materials International",
issn = "1598-9623",
publisher = "Korean Institute of Metals and Materials",
number = "3",

}

Hybrid copper complex-derived conductive patterns printed on polyimide substrates. / Lee, Byoungyoon; Jeong, Sooncheol; Kim, Yoonhyun; Jeong, Inbum; Woo, Kyoohee; Moon, Joo Ho.

In: Metals and Materials International, Vol. 18, No. 3, 01.06.2012, p. 493-498.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Hybrid copper complex-derived conductive patterns printed on polyimide substrates

AU - Lee, Byoungyoon

AU - Jeong, Sooncheol

AU - Kim, Yoonhyun

AU - Jeong, Inbum

AU - Woo, Kyoohee

AU - Moon, Joo Ho

PY - 2012/6/1

Y1 - 2012/6/1

N2 - We synthesized new copper complexes that can be readily converted into highly conductive Cu film. Mechanochemical milling of copper (I) oxide suspended in formic acid resulted in the submicron-sized Cu formate together Cu nanoparticles. The submicrometer-sized Cu formates are reactive toward inter-particle sintering and metallic Cu seeds present in the Cu complexes assist their decomposition and the nucleation of Cu. The hybrid copper complex film printed on polyimide substrate is decomposed into dense and uniform Cu layer after annealing at 250 °C for 30 min under nitrogen atmosphere. The resulting Cu film exhibited a low resistivity of 8.2 μω·cm and good adhesion characteristics.

AB - We synthesized new copper complexes that can be readily converted into highly conductive Cu film. Mechanochemical milling of copper (I) oxide suspended in formic acid resulted in the submicron-sized Cu formate together Cu nanoparticles. The submicrometer-sized Cu formates are reactive toward inter-particle sintering and metallic Cu seeds present in the Cu complexes assist their decomposition and the nucleation of Cu. The hybrid copper complex film printed on polyimide substrate is decomposed into dense and uniform Cu layer after annealing at 250 °C for 30 min under nitrogen atmosphere. The resulting Cu film exhibited a low resistivity of 8.2 μω·cm and good adhesion characteristics.

UR - http://www.scopus.com/inward/record.url?scp=84863839298&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84863839298&partnerID=8YFLogxK

U2 - 10.1007/s12540-012-3017-z

DO - 10.1007/s12540-012-3017-z

M3 - Article

VL - 18

SP - 493

EP - 498

JO - Metals and Materials International

JF - Metals and Materials International

SN - 1598-9623

IS - 3

ER -