Hybrid Test Access Mechanism for Multiple Identical Cores

Sangjun Lee, Jongho Park, Inhwan Lee, Kwonhyoung Lee, Sungho Kang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recently, the demand for artificial intelligence such as IoT, autonomous vehicles and cloud is rapidly increased, and intelligent processors are expected to be used in all objects such as home appliances and automobiles. Intelligent processors are composed of multiple identical cores for parallel computation and acceleration of neural networks to implement artificial intelligence services. Due to the high degree of integration and the increase of test complexity in intelligent processors, efficient parallel testing is required. In this paper, a new test access mechanism is proposed to test the multiple identical cores. The proposed method solves the problem of the previous parallel test access mechanism in low-yield system without additional hardware and can test multiple identical cores at the cost of testing one core.

Original languageEnglish
Title of host publicationProceedings - International SoC Design Conference 2021, ISOCC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages365-366
Number of pages2
ISBN (Electronic)9781665401746
DOIs
Publication statusPublished - 2021
Event18th International System-on-Chip Design Conference, ISOCC 2021 - Jeju Island, Korea, Republic of
Duration: 2021 Oct 62021 Oct 9

Publication series

NameProceedings - International SoC Design Conference 2021, ISOCC 2021

Conference

Conference18th International System-on-Chip Design Conference, ISOCC 2021
Country/TerritoryKorea, Republic of
CityJeju Island
Period21/10/621/10/9

Bibliographical note

Funding Information:
ACKNOWLEDGMENT This work was supported by the MOTIE and KEIT [20012010, Design for Test of Intelligent Processors].

Publisher Copyright:
© 2021 IEEE.

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Information Systems
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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