Implantable flexible wireless pressure sensor module

Kyu Ho Shin, Chang Youl Moon, Tae Hee Lee, Chang Hyun Lim, Young Jun Kim

Research output: Contribution to conferencePaper

10 Citations (Scopus)

Abstract

Chip embedded flexible Packaging scheme has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips (t<50/Mn) are fabricated by chemical etching process to avoid possible surface damage. These technologies can be used for an implantable real-time monitoring of blood pressure. Our research targets are developing implantable blood pressure sensor module and its telemetric measurement. By winding around the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessel.

Original languageEnglish
Pages844-847
Number of pages4
Publication statusPublished - 2004 Dec 1
EventIEEE Sensors 2004 - Vienna, Austria
Duration: 2004 Oct 242004 Oct 27

Other

OtherIEEE Sensors 2004
CountryAustria
CityVienna
Period04/10/2404/10/27

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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  • Cite this

    Shin, K. H., Moon, C. Y., Lee, T. H., Lim, C. H., & Kim, Y. J. (2004). Implantable flexible wireless pressure sensor module. 844-847. Paper presented at IEEE Sensors 2004, Vienna, Austria.