Abstract
We have proposed a UHF/HF multi-band RFID reader, and we have implemented it into SiP with Package-on- Package technology. The proposed SiP RFID reader has been designed to support both for EPCgloabal Classl Generation 2 protocol of UHF band, and 13.56MHz RFID protocols of ISO 14443 A/B type, and IS015693 standards. The operating mode is controlled by embedded 32-bit RISC core, and the mode can be selected by users. The area of implemented SiP is 40mm × 40mm with 4 substrate layers. The implemented reader SiP operates at single supply voltage of 3.3V. The maximum current consumption is 210mA. The measured operating distances are about 5cm for 13.56MHz modes, and about 20cm for UHF mode.
| Original language | English |
|---|---|
| Title of host publication | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings |
| Pages | 65-68 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2008 Dec 1 |
| Event | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of Duration: 2008 Dec 10 → 2008 Dec 12 |
Publication series
| Name | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings |
|---|
Other
| Other | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 |
|---|---|
| Country | Korea, Republic of |
| City | Seoul |
| Period | 08/12/10 → 08/12/12 |
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All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Electrical and Electronic Engineering
Cite this
}
Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology. / Yi, Kyeongil; Kim, Hyunsik; Kim, Jaewhan; Kim, Jikon; Cho, Junghyun; An, Kwangduk; Kim, Shiho.
2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. p. 65-68 4736000 (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology
AU - Yi, Kyeongil
AU - Kim, Hyunsik
AU - Kim, Jaewhan
AU - Kim, Jikon
AU - Cho, Junghyun
AU - An, Kwangduk
AU - Kim, Shiho
PY - 2008/12/1
Y1 - 2008/12/1
N2 - We have proposed a UHF/HF multi-band RFID reader, and we have implemented it into SiP with Package-on- Package technology. The proposed SiP RFID reader has been designed to support both for EPCgloabal Classl Generation 2 protocol of UHF band, and 13.56MHz RFID protocols of ISO 14443 A/B type, and IS015693 standards. The operating mode is controlled by embedded 32-bit RISC core, and the mode can be selected by users. The area of implemented SiP is 40mm × 40mm with 4 substrate layers. The implemented reader SiP operates at single supply voltage of 3.3V. The maximum current consumption is 210mA. The measured operating distances are about 5cm for 13.56MHz modes, and about 20cm for UHF mode.
AB - We have proposed a UHF/HF multi-band RFID reader, and we have implemented it into SiP with Package-on- Package technology. The proposed SiP RFID reader has been designed to support both for EPCgloabal Classl Generation 2 protocol of UHF band, and 13.56MHz RFID protocols of ISO 14443 A/B type, and IS015693 standards. The operating mode is controlled by embedded 32-bit RISC core, and the mode can be selected by users. The area of implemented SiP is 40mm × 40mm with 4 substrate layers. The implemented reader SiP operates at single supply voltage of 3.3V. The maximum current consumption is 210mA. The measured operating distances are about 5cm for 13.56MHz modes, and about 20cm for UHF mode.
UR - http://www.scopus.com/inward/record.url?scp=60649116976&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=60649116976&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2008.4736000
DO - 10.1109/EDAPS.2008.4736000
M3 - Conference contribution
SN - 9781424426331
T3 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
SP - 65
EP - 68
BT - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
ER -