Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology

Kyeongil Yi, Hyunsik Kim, Jaewhan Kim, Jikon Kim, Junghyun Cho, Kwangduk An, Shiho Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We have proposed a UHF/HF multi-band RFID reader, and we have implemented it into SiP with Package-on- Package technology. The proposed SiP RFID reader has been designed to support both for EPCgloabal Classl Generation 2 protocol of UHF band, and 13.56MHz RFID protocols of ISO 14443 A/B type, and IS015693 standards. The operating mode is controlled by embedded 32-bit RISC core, and the mode can be selected by users. The area of implemented SiP is 40mm × 40mm with 4 substrate layers. The implemented reader SiP operates at single supply voltage of 3.3V. The maximum current consumption is 210mA. The measured operating distances are about 5cm for 13.56MHz modes, and about 20cm for UHF mode.

Original languageEnglish
Title of host publication2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
Pages65-68
Number of pages4
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of
Duration: 2008 Dec 102008 Dec 12

Publication series

Name2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

Other

Other2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
CountryKorea, Republic of
CitySeoul
Period08/12/1008/12/12

Fingerprint

Radio frequency identification (RFID)
Network protocols
Reduced instruction set computing
System-in-package
Electric potential
Substrates

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Yi, K., Kim, H., Kim, J., Kim, J., Cho, J., An, K., & Kim, S. (2008). Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings (pp. 65-68). [4736000] (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings). https://doi.org/10.1109/EDAPS.2008.4736000
Yi, Kyeongil ; Kim, Hyunsik ; Kim, Jaewhan ; Kim, Jikon ; Cho, Junghyun ; An, Kwangduk ; Kim, Shiho. / Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology. 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. pp. 65-68 (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings).
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Yi, K, Kim, H, Kim, J, Kim, J, Cho, J, An, K & Kim, S 2008, Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology. in 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings., 4736000, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings, pp. 65-68, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, Seoul, Korea, Republic of, 08/12/10. https://doi.org/10.1109/EDAPS.2008.4736000

Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology. / Yi, Kyeongil; Kim, Hyunsik; Kim, Jaewhan; Kim, Jikon; Cho, Junghyun; An, Kwangduk; Kim, Shiho.

2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. p. 65-68 4736000 (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Yi K, Kim H, Kim J, Kim J, Cho J, An K et al. Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. p. 65-68. 4736000. (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings). https://doi.org/10.1109/EDAPS.2008.4736000