Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology

Kyeongil Yi; Hyunsik Kim; Jaewhan Kim; Jikon Kim; Junghyun Cho; Kwangduk An; Shiho Kim

doi:10.1109/EDAPS.2008.4736000

Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology

Kyeongil Yi, Hyunsik Kim, Jaewhan Kim, Jikon Kim, Junghyun Cho, Kwangduk An, Shiho Kim

School of Integrated Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

We have proposed a UHF/HF multi-band RFID reader, and we have implemented it into SiP with Package-on- Package technology. The proposed SiP RFID reader has been designed to support both for EPCgloabal Classl Generation 2 protocol of UHF band, and 13.56MHz RFID protocols of ISO 14443 A/B type, and IS015693 standards. The operating mode is controlled by embedded 32-bit RISC core, and the mode can be selected by users. The area of implemented SiP is 40mm × 40mm with 4 substrate layers. The implemented reader SiP operates at single supply voltage of 3.3V. The maximum current consumption is 210mA. The measured operating distances are about 5cm for 13.56MHz modes, and about 20cm for UHF mode.

Original language	English
Title of host publication	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
Pages	65-68
Number of pages	4
DOIs	https://doi.org/10.1109/EDAPS.2008.4736000
Publication status	Published - 2008 Dec 1
Event	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Seoul, Korea, Republic of Duration: 2008 Dec 10 → 2008 Dec 12

Publication series

Name	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings

Other

Other	2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Country	Korea, Republic of
City	Seoul
Period	08/12/10 → 08/12/12

All Science Journal Classification (ASJC) codes

Control and Systems Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/EDAPS.2008.4736000

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Yi, K., Kim, H., Kim, J., Kim, J., Cho, J., An, K., & Kim, S. (2008). Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings (pp. 65-68). [4736000] (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings). https://doi.org/10.1109/EDAPS.2008.4736000

Yi, Kyeongil ; Kim, Hyunsik ; Kim, Jaewhan ; Kim, Jikon ; Cho, Junghyun ; An, Kwangduk ; Kim, Shiho. / Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology. 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. pp. 65-68 (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings).

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title = "Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology",

abstract = "We have proposed a UHF/HF multi-band RFID reader, and we have implemented it into SiP with Package-on- Package technology. The proposed SiP RFID reader has been designed to support both for EPCgloabal Classl Generation 2 protocol of UHF band, and 13.56MHz RFID protocols of ISO 14443 A/B type, and IS015693 standards. The operating mode is controlled by embedded 32-bit RISC core, and the mode can be selected by users. The area of implemented SiP is 40mm × 40mm with 4 substrate layers. The implemented reader SiP operates at single supply voltage of 3.3V. The maximum current consumption is 210mA. The measured operating distances are about 5cm for 13.56MHz modes, and about 20cm for UHF mode.",

author = "Kyeongil Yi and Hyunsik Kim and Jaewhan Kim and Jikon Kim and Junghyun Cho and Kwangduk An and Shiho Kim",

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Yi, K, Kim, H, Kim, J, Kim, J, Cho, J, An, K & Kim, S 2008, Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology. in 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings., 4736000, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings, pp. 65-68, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, Seoul, Korea, Republic of, 08/12/10. https://doi.org/10.1109/EDAPS.2008.4736000

Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology. / Yi, Kyeongil; Kim, Hyunsik; Kim, Jaewhan; Kim, Jikon; Cho, Junghyun; An, Kwangduk; Kim, Shiho.

2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. p. 65-68 4736000 (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - We have proposed a UHF/HF multi-band RFID reader, and we have implemented it into SiP with Package-on- Package technology. The proposed SiP RFID reader has been designed to support both for EPCgloabal Classl Generation 2 protocol of UHF band, and 13.56MHz RFID protocols of ISO 14443 A/B type, and IS015693 standards. The operating mode is controlled by embedded 32-bit RISC core, and the mode can be selected by users. The area of implemented SiP is 40mm × 40mm with 4 substrate layers. The implemented reader SiP operates at single supply voltage of 3.3V. The maximum current consumption is 210mA. The measured operating distances are about 5cm for 13.56MHz modes, and about 20cm for UHF mode.

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Yi K, Kim H, Kim J, Kim J, Cho J, An K et al. Implementation of HF/UHF multiband RFID reader SiP with package-on-package technology. In 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. 2008. p. 65-68. 4736000. (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings). https://doi.org/10.1109/EDAPS.2008.4736000