Implementation of single-wire communication protocol for 3D IC thermal management systems using a thin Film thermoelectric cooler

Nam Jae Kim, Hyun Ju Lee, Shiho Kim

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a 0.13 μm CMOS MPW process, and the operation of the chip is verified.

Original languageEnglish
Pages (from-to)18-23
Number of pages6
JournalJournal of Semiconductor Technology and Science
Volume12
Issue number1
DOIs
Publication statusPublished - 2012 Mar

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Implementation of single-wire communication protocol for 3D IC thermal management systems using a thin Film thermoelectric cooler'. Together they form a unique fingerprint.

  • Cite this