Implementation of single-wire communication protocol for 3D IC thermal management systems using a thin Film thermoelectric cooler

Nam Jae Kim, Hyun Ju Lee, Shiho Kim

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1 Citation (Scopus)


We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a 0.13 μm CMOS MPW process, and the operation of the chip is verified.

Original languageEnglish
Pages (from-to)18-23
Number of pages6
JournalJournal of Semiconductor Technology and Science
Issue number1
Publication statusPublished - 2012 Jan 1


All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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