Implementation of single-wire communication protocol for 3D IC thermal management systems using a thin Film thermoelectric cooler

Nam Jae Kim, Hyun Ju Lee, Shiho Kim

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a 0.13 μm CMOS MPW process, and the operation of the chip is verified.

Original languageEnglish
Pages (from-to)18-23
Number of pages6
JournalJournal of Semiconductor Technology and Science
Volume12
Issue number1
DOIs
Publication statusPublished - 2012 Jan 1

Fingerprint

Temperature sensors
Temperature control
Wire
Network protocols
Thin films
Cooling
Temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

@article{48df98459da44e9da33d814bc27420e8,
title = "Implementation of single-wire communication protocol for 3D IC thermal management systems using a thin Film thermoelectric cooler",
abstract = "We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a 0.13 μm CMOS MPW process, and the operation of the chip is verified.",
author = "Kim, {Nam Jae} and Lee, {Hyun Ju} and Shiho Kim",
year = "2012",
month = "1",
day = "1",
doi = "10.5573/JSTS.2012.12.1.18",
language = "English",
volume = "12",
pages = "18--23",
journal = "Journal of Semiconductor Technology and Science",
issn = "1598-1657",
publisher = "Institute of Electronics Engineers of Korea",
number = "1",

}

Implementation of single-wire communication protocol for 3D IC thermal management systems using a thin Film thermoelectric cooler. / Kim, Nam Jae; Lee, Hyun Ju; Kim, Shiho.

In: Journal of Semiconductor Technology and Science, Vol. 12, No. 1, 01.01.2012, p. 18-23.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Implementation of single-wire communication protocol for 3D IC thermal management systems using a thin Film thermoelectric cooler

AU - Kim, Nam Jae

AU - Lee, Hyun Ju

AU - Kim, Shiho

PY - 2012/1/1

Y1 - 2012/1/1

N2 - We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a 0.13 μm CMOS MPW process, and the operation of the chip is verified.

AB - We propose and implement a single-wire communication protocol for thermal management systems using thin film thermoelectric modules for 3D IC cooling. The proposed single-wire communication protocol connects the temperature sensors, located near hot spots, to measure the local temperature of the chip. A unique ID number identifying the location of each hot spot is assigned to each temperature sensor. The prototype chip was fabricated by a 0.13 μm CMOS MPW process, and the operation of the chip is verified.

UR - http://www.scopus.com/inward/record.url?scp=84930473221&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84930473221&partnerID=8YFLogxK

U2 - 10.5573/JSTS.2012.12.1.18

DO - 10.5573/JSTS.2012.12.1.18

M3 - Article

VL - 12

SP - 18

EP - 23

JO - Journal of Semiconductor Technology and Science

JF - Journal of Semiconductor Technology and Science

SN - 1598-1657

IS - 1

ER -