Electroless deposition requires preliminary surface treatment to effectively adsorb a metal electrode layer onto a ceramic substrate. Herein, a simple surface treatment using an all-wet process was performed to achieve adhesion stability between a Si3N4 substrate and Ni film. The method involved deposition of an interfacial Pd-TiO2 buffer between the two layers. Surface pretreatment via silanization was initially performed to improve surface wettability, thereby enhancing uniform deposition of Pd-TiO2. Subsequently, a thin Ni layer was directly deposited onto the Pd-TiO2 layer without necessitating sensitization or activation. The synthesized Ni/PdTiO2/Si3N4 heat sink exhibited excellent adhesion property in the cross-hatch, scratch, and thermal shock tests. The mechanism of adhesion enhancement involved chemical bonding of Pd-TiO2 with the self-assembled monolayer on the substrate and reduced internal stress due to removal of residual hydrogen between the layers of the heat sink. Thus, the fabricated heat sink has a promising application in electronic devices operated at high temperatures.
Bibliographical noteFunding Information:
This work was mainly supported by the Global Frontier Program through the Global Frontier Hybrid Interface Materials project of the National Research Foundation of Korea, which was funded by the Ministry of Science, ICT & Future Planning (2018010003). The work was also supported by the New & Renewable Energy Core Technology Program of the Korea Institute of Energy Technology Evaluation and Planning with financial resource granted by the Ministry of Trade, Industry & Energy, Republic of Korea (No. 20162000000910). Additional sources of support included the Korea Institute of Materials Science and the Korea Institute of Materials Science (CAP-16-10-KIMS).
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials