In-Plane Deformation Mechanics for Highly Stretchable Electronics

Yewang Su, Xuecheng Ping, Ki Jun Yu, Jung Woo Lee, Jonathan A. Fan, Bo Wang, Ming Li, Rui Li, Daniel V. Harburg, Yong An Huang, Cunjiang Yu, Shimin Mao, Jaehoun Shim, Qinglin Yang, Pei Yin Lee, Agne Armonas, Ki Joong Choi, Yichen Yang, Ungyu Paik, Tammy ChangThomas J. Dawidczyk, Yonggang Huang, Shuodao Wang, John A. Rogers

Research output: Contribution to journalArticlepeer-review

98 Citations (Scopus)
Original languageEnglish
Article number1604989
JournalAdvanced Materials
Issue number8
Publication statusPublished - 2017 Feb

Bibliographical note

Funding Information:
Y.S. acknowledges the support from Chinese Academy of Sciences via the ?Hundred Talent program?, the National Science Foundation of China (NSFC, No. 11572323), and the State Key Laboratory of Structural Analysis for Industrial Equipment at Dalian University of Technology (No. GZ1603). X.P. acknowledges the support of NSFC (No. 51365013) and the Natural Science Foundation of Jiangxi Province of China through grant No. 20133ACB21002. J.W.L. and U.P. thank the GRL Program (K20704000003TA050000310) through the NRF funded by the Ministry of Science. S.W. acknowledges the support from the ASME Applied Mechanics Division-Haythornthwaite Foundation Research Initiation Grant, and partial support from the NSFC (Nos. 11272260, 11172022, 11572022, 51075327, and 11302038). Y.H. acknowledges the support from NSF (DMR-1121262, CMMI-1300846, CMMI-1400169, and IIP-1534120). J.A.R. acknowledges supports from the U.S. Department of Energy, Office of Science, Basic Energy Sciences, under Award # DE-FG02-07ER46741.

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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