Two in situ measurement schemes, using micromachined resonant string structures, for the measurement of the polyimide residual stress and polyimide/metal adhesion durability have been developed. The residual stress of polyimide films, DuPont PI-2555 and PI-2611, have been measured using a bulk micromachined string structure. According to the Rayleigh's method, the resonant frequency of a polyimide string can be related to the film stress. By measuring the resonant frequency of these polyimide strings, the residual stresses have been calculated. The measurement results of various strings have been compared with conventional measurement results, which shows that they are in good agreement. Also, a noble scheme to quantize the adhesion durability between a polyimide film and a metal film has been developed. This scheme is based on a polyimide/metal bimorph string structures, fabricated using a surface micromachining technique, vibrating with an alternating potential. The change of resonance profile of this string structure can be related to the degradation of adhesion strength at the polyimide/metal interface. Various polyimide/gold string structures have been fabricated using a surface micromachining with Cu sacrificial layers, and the resonant qualities have been monitored. Notable changes of resonant Q-factor and resonant frequency, due to the degradation of adhesion between the metal and polyimide, have been observed after 108 cycles (string vibration) for the polyimide/gold bimorph strings. The changes of resonant Q-factor and resonant frequency over a time period (vibration cycles) have been monitored.
|Number of pages||9|
|Journal||IEEE Transactions on Components and Packaging Technologies|
|Publication status||Published - 1999|
Bibliographical noteFunding Information:
Manuscript received September 1, 1998; revised March 1, 1999. This paper was recommended for publication by Editor J. Morris upon evaluation of the reviewers’ comments. This work was supported in part by the National Science Foundation through the Georgia Tech/NSF Engineering Research Center in Electronic Packaging, Contract EEC-9402723.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering