Abstract
Two in situ measurement schemes, using micromachined resonant string structures, for the measurement of the polyimide residual stress and polyimide/metal adhesion durability have been developed. The residual stress of polyimide films, DuPont PI-2555 and PI-2611, have been measured using a bulk micromachined string structure. According to the Rayleigh's method, the resonant frequency of a polyimide string can be related to the film stress. By measuring the resonant frequency of these polyimide strings, the residual stresses have been calculated. The measurement results of various strings have been compared with conventional measurement results, which shows that they are in good agreement. Also, a noble scheme to quantize the adhesion durability between a polyimide film and a metal film has been developed. This scheme is based on a polyimide/metal bimorph string structures, fabricated using a surface micromachining technique, vibrating with an alternating potential. The change of resonance profile of this string structure can be related to the degradation of adhesion strength at the polyimide/metal interface. Various polyimide/gold string structures have been fabricated using a surface micromachining with Cu sacrificial layers, and the resonant qualities have been monitored. Notable changes of resonant Q-factor and resonant frequency, due to the degradation of adhesion between the metal and polyimide, have been observed after 108 cycles (string vibration) for the polyimide/gold bimorph strings. The changes of resonant Q-factor and resonant frequency over a time period (vibration cycles) have been monitored.
| Original language | English |
|---|---|
| Pages (from-to) | 282-290 |
| Number of pages | 9 |
| Journal | IEEE Transactions on Components and Packaging Technologies |
| Volume | 22 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 1999 Dec 1 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
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In situ measurement of mechanical properties of polyimide films using micromachined resonant string structures. / Kim, Yong Jun; Allen, Mark G.
In: IEEE Transactions on Components and Packaging Technologies, Vol. 22, No. 2, 01.12.1999, p. 282-290.Research output: Contribution to journal › Article
TY - JOUR
T1 - In situ measurement of mechanical properties of polyimide films using micromachined resonant string structures
AU - Kim, Yong Jun
AU - Allen, Mark G.
PY - 1999/12/1
Y1 - 1999/12/1
N2 - Two in situ measurement schemes, using micromachined resonant string structures, for the measurement of the polyimide residual stress and polyimide/metal adhesion durability have been developed. The residual stress of polyimide films, DuPont PI-2555 and PI-2611, have been measured using a bulk micromachined string structure. According to the Rayleigh's method, the resonant frequency of a polyimide string can be related to the film stress. By measuring the resonant frequency of these polyimide strings, the residual stresses have been calculated. The measurement results of various strings have been compared with conventional measurement results, which shows that they are in good agreement. Also, a noble scheme to quantize the adhesion durability between a polyimide film and a metal film has been developed. This scheme is based on a polyimide/metal bimorph string structures, fabricated using a surface micromachining technique, vibrating with an alternating potential. The change of resonance profile of this string structure can be related to the degradation of adhesion strength at the polyimide/metal interface. Various polyimide/gold string structures have been fabricated using a surface micromachining with Cu sacrificial layers, and the resonant qualities have been monitored. Notable changes of resonant Q-factor and resonant frequency, due to the degradation of adhesion between the metal and polyimide, have been observed after 108 cycles (string vibration) for the polyimide/gold bimorph strings. The changes of resonant Q-factor and resonant frequency over a time period (vibration cycles) have been monitored.
AB - Two in situ measurement schemes, using micromachined resonant string structures, for the measurement of the polyimide residual stress and polyimide/metal adhesion durability have been developed. The residual stress of polyimide films, DuPont PI-2555 and PI-2611, have been measured using a bulk micromachined string structure. According to the Rayleigh's method, the resonant frequency of a polyimide string can be related to the film stress. By measuring the resonant frequency of these polyimide strings, the residual stresses have been calculated. The measurement results of various strings have been compared with conventional measurement results, which shows that they are in good agreement. Also, a noble scheme to quantize the adhesion durability between a polyimide film and a metal film has been developed. This scheme is based on a polyimide/metal bimorph string structures, fabricated using a surface micromachining technique, vibrating with an alternating potential. The change of resonance profile of this string structure can be related to the degradation of adhesion strength at the polyimide/metal interface. Various polyimide/gold string structures have been fabricated using a surface micromachining with Cu sacrificial layers, and the resonant qualities have been monitored. Notable changes of resonant Q-factor and resonant frequency, due to the degradation of adhesion between the metal and polyimide, have been observed after 108 cycles (string vibration) for the polyimide/gold bimorph strings. The changes of resonant Q-factor and resonant frequency over a time period (vibration cycles) have been monitored.
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UR - http://www.scopus.com/inward/citedby.url?scp=0033311126&partnerID=8YFLogxK
U2 - 10.1109/6144.774746
DO - 10.1109/6144.774746
M3 - Article
AN - SCOPUS:0033311126
VL - 22
SP - 282
EP - 290
JO - IEEE Transactions on Components and Packaging Technologies
JF - IEEE Transactions on Components and Packaging Technologies
SN - 1521-3331
IS - 2
ER -