Increasing strength and conductivity of Cu alloy through abnormal plastic deformation of an intermetallic compound

Seung Zeon Han, Sung Hwan Lim, Sangshik Kim, Jehyun Lee, Masahiro Goto, Hyung Giun Kim, Byungchan Han, Kwang Ho Kim

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original length without breakage at room temperature using conventional rolling process. By inducing such an one-directional array of nanofibers of intermetallic compound from the uniform distribution of fine precipitates in the bulk Cu alloys, the trade-off between strength and conductivity and between strength and ductility could be significantly reduced. We observed a simultaneous increase in electrical conductivity by 1.3 times and also tensile strength by 1.3 times in this Cu alloy bulk compared to the conventional Cu alloys.

Original languageEnglish
Article number30907
JournalScientific reports
Volume6
DOIs
Publication statusPublished - 2016 Aug 4

All Science Journal Classification (ASJC) codes

  • General

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